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LC786961W

Onsemi

LC786961W by Onsemi

LC786961W by Onsemi is a consumer circuit IC with 144 terminals in a square package. It operates b/w -40 to 85 °C, suitable for industrial use. With a min supply voltage of 3V and max of 3.6V, it is ideal for various consumer electronic applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,196 parts In-Stock

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Vyrian

USA . 340 parts In-Stock

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340

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SupplyDigital Components

Austria . 4,856 parts In-Stock

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4,856

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Kulean Microsystems

USA . 4,329 parts In-Stock

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Problanco Electronics

Mexico . 4,183 parts In-Stock

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Corohmni

South Africa . 424 parts In-Stock

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424

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Corphita

USA . 411 parts In-Stock

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411

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TANS Electronics

Latvia . 298 parts In-Stock

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UHIMA Technologies

Türkiye . 266 parts In-Stock

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Overview

Upgrade your consumer electronics with the LC786961W by Onsemi, a top-quality product designed to enhance performance and reliability. Manufactured by Onsemi, a leader in the industry known for their cutting-edge technology and innovation, this versatile IC is perfect for a wide range of applications. With its advanced features and durable construction, the LC786961W offers exceptional value, benefits, and advantages to customers looking for superior quality and functionality. Experience the difference with Onsemi's LC786961W and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for consumer electronics applications.

Surface Mount: YES

Being surface mountable, this product is easy to integrate into PCBs, saving space and making assembly more efficient.

Package Shape: SQUARE

The square package shape allows for easy placement on a PCB and efficient use of board space.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC is versatile and well-suited for a wide range of consumer electronics.

No. of Terminals: 144

With a high number of terminals, this IC can support complex circuit designs and functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style allows for compact design and high-density mounting on a PCB.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and ensure reliable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function effectively in cold environments without risk of damage.

Terminal Position: QUAD

The quad terminal position simplifies PCB layout and assembly, enhancing efficiency during production.

Maximum Seated Height: 1.6 mm

The low maximum seated height enables the IC to be mounted in slim devices or in applications with space constraints.

Width: 20 mm

The compact width of 20mm makes this IC suitable for applications where space-saving is critical.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and extends the product's usability.

Length: 20 mm

With a length of 20mm, this IC can fit into compact spaces and slender designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding industrial environments.

Technology: CMOS

The use of CMOS technology allows for low power consumption, high noise immunity, and compatibility with various digital systems.

Terminal Form: GULL WING

The gull wing terminal form facilitates soldering during assembly, improving the overall reliability of the IC.

Terminal Pitch: 0.5 mm

With a small terminal pitch of 0.5 mm, this IC offers high-density mounting capabilities, enabling complex circuit designs.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides flexibility in power input options for the IC.

Technical Specifications

Other Function Consumer ICs LC786961W attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of Functions:

1

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Trade Compliance

LC786961W General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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