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LC786960E

Onsemi

LC786960E by Onsemi

LC786960E by Onsemi is a consumer circuit IC with 100 terminals in a rectangular flatpack package. It operates b/w -40 °C to 85°C, suitable for industrial applications. With a supply voltage range of 3V to 3.6V, it is ideal for various electronic devices requiring precise control and processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,204 parts In-Stock

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2,204

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Vyrian

USA . 281 parts In-Stock

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281

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 6,759 parts In-Stock

1+ parts

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6,759

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SupplyDigital Components

Austria . 6,442 parts In-Stock

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6,442

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Corphita

USA . 2,162 parts In-Stock

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2,162

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Problanco Electronics

Mexico . 1,508 parts In-Stock

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1,508

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UHIMA Technologies

Türkiye . 823 parts In-Stock

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823

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Corohmni

South Africa . 352 parts In-Stock

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352

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Kulean Microsystems

USA . 115 parts In-Stock

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115

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Overview

Experience superior performance and reliability with the LC786960E by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and cutting-edge technology in all their products. This consumer IC is perfect for a wide range of applications, offering unmatched value and benefits to customers. Whether you're looking for efficiency, durability, or versatility, the LC786960E delivers it all. Upgrade your electronic devices today with this exceptional product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for consumer applications.

Surface Mount: YES

Easy to install and saves space on PCB.

Package Shape: RECTANGULAR

Standard shape for easy integration into circuit designs.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronics, ensuring compatibility and performance.

No. of Terminals: 100

Sufficient number of terminals for complex circuit connections.

Package Style (Meter): FLATPACK

Compact design for space-constrained applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ideal for industrial environments.

Minimum Operating Temperature: -40 °C

Suitable for a wide range of operating conditions.

Terminal Position: QUAD

Quad terminal position for secure and stable connections.

Maximum Seated Height: 3 mm

Low profile design for slim devices.

Width: 14 mm

Compact width for space-saving integration.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage for energy-efficient operation.

Length: 20 mm

Optimal length for various circuit layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for reliable performance in harsh environments.

Technology: CMOS

CMOS technology for low power consumption and high speed operation.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and secure connections.

Terminal Pitch: 0.65 mm

Fine terminal pitch for precise connections in compact spaces.

Maximum Supply Voltage (Vsup): 3.6 V

Safe maximum supply voltage for stable operation.

Technical Specifications

Other Function Consumer ICs LC786960E attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PQFP-G100

Length:

20 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Seated Height:

3 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LC786960E General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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