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J308

Onsemi

J308 by Onsemi

Onsemi's J308 is an N-CHANNEL RF FET with 25V DS Breakdown Voltage. Ideal for AMPLIFIER applications in ULTRA HIGH FREQUENCY BAND, it features DEPLETION MODE operation and 2.5pF Crss for high performance. Package: PLASTIC/EPOXY, Shape: ROUND, Terminals: 3.

Median Price

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Lifecycle Status

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11

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Vyrian

USA . 100,252 parts In-Stock

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Digiode

USA . 7,273 parts In-Stock

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Kruse Electronics AG

Switzerland . 5,000 parts In-Stock

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Anansix

USA . 2,304 parts In-Stock

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Extreme Components

USA . 200 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 90 parts In-Stock

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LittleDiode

UK . 9 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 8 parts In-Stock

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PC Components Company LLC

USA . 5 parts In-Stock

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Bristol Electronics

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Huijzer Components

Netherlands . 5 parts In-Stock

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One Stop Electronics

USA . 277 parts In-Stock

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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SupplyDigital Components

Austria . 7,853 parts In-Stock

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UNI Independent Distributors

Spain . 7,733 parts In-Stock

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Corphita

USA . 3,684 parts In-Stock

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Problanco Electronics

Mexico . 3,493 parts In-Stock

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Kulean Microsystems

USA . 2,399 parts In-Stock

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TANS Electronics

Latvia . 1,156 parts In-Stock

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UHIMA Technologies

Türkiye . 551 parts In-Stock

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Assy Fe

Spain . 440 parts In-Stock

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Corohmni

South Africa . 423 parts In-Stock

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Infinite Electronics LLP (Excess)

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Overview

Enhance your RF amplifier applications with the J308 by Onsemi. Manufactured with top-quality materials and cutting-edge technology, this N-CHANNEL FET offers unparalleled performance in the ultra-high frequency band. Its single configuration and depletion mode operation make it a versatile choice for various amplification needs. With a minimum DS breakdown voltage of 25V and maximum feedback capacitance of 2.5pF, the J308 guarantees reliability and efficiency. Upgrade your projects today with the superior value and benefits this transistor brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to external elements, making the transistor suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have higher electron mobility, offering better performance in terms of speed and power efficiency.

Configuration: SINGLE

Single configuration transistors are simple to use and ideal for basic amplifier applications.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance in amplifying electronic signals.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this transistor can handle higher voltages, making it suitable for a wider range of applications.

Package Shape: ROUND

The round package shape provides efficient thermal dissipation and easy mounting, enhancing overall performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer reliable connections and easier soldering, ensuring stable operation in various circuit designs.

Operating Mode: DEPLETION MODE

Depletion mode transistors have inherent negative voltage gate protection, adding a level of safety in circuit design.

Package Style (Meter): CYLINDRICAL

The cylindrical package style offers compact size and efficient use of space in electronic circuits.

Field Effect Transistor Technology: JUNCTION

Junction FET technology provides high input impedance and low noise characteristics, ensuring accurate signal amplification.

Maximum Operating Temperature: 125 °C

Capable of operating at temperatures up to 125 °C, making it suitable for industrial and automotive applications where high temperatures are common.

Transistor Element Material: SILICON

Silicon transistors offer high reliability, temperature stability, and manufacturing consistency, ensuring consistent performance over time.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides good solderability and electrical conductivity, ensuring reliable connections in diverse circuit designs.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easy mounting on PCBs and efficient routing of connections, simplifying assembly.

Maximum Feedback Capacitance (Crss): 2.5 pF

Low feedback capacitance minimizes signal loss and distortion, ensuring high fidelity signal amplification in audio applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) J308 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

2.5 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

125 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

J308 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

1560-99-605-2269, 1560996052269, 5355-00-667-6283, 5355006676283, 4730-00-203-9766, 4730002039766

NIIN

996052269, 006676283, 002039766

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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