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BF998R-TAPE-13

NXP Semiconductors

BF998R-TAPE-13 by NXP Semiconductors

BF998R-TAPE-13 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a max DS breakdown voltage of 12V, operates in the ultra-high frequency band, and supports dual gate depletion mode. This compact surface mount device ensures efficient performance in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Anansix

USA . 1,906 parts In-Stock

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Vyrian

USA . 1,571 parts In-Stock

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Digiode

USA . 1,245 parts In-Stock

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One Stop Electronics

USA . 976 parts In-Stock

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$31.050

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UNI Independent Distributors

Spain . 4,107 parts In-Stock

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Corphita

USA . 1,872 parts In-Stock

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Northwest PG Solutions

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Native Components

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Overview

Elevate your designs with the BF998R-TAPE-13 from NXP Semiconductors, a pinnacle of quality in RF small signal transistors. Engineered for superior amplification and reliability, this N-channel FET excels in ultra-high frequency applications, making it perfect for innovative communication solutions. With NXP's commitment to excellence, you gain unmatched performance and efficiency, ensuring your projects stand out and thrive in today's dynamic market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and resistance to environmental factors, making the product reliable in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher efficiency and better performance in amplification applications, making them suitable for a wide range of electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The integrated diode allows for added protection and functionality, enabling ease of use in designs where reverse current could be an issue.

Transistor Application: AMPLIFIER

Designed for amplification, this FET is ideal for audio and RF applications, providing high gain and signal integrity.

Surface Mount: YES

Surface mount technology minimizes footprint, allowing for compact circuit designs and improved performance in high-density applications.

Minimum DS Breakdown Voltage: 12 V

The 12 V breakdown voltage ensures reliable performance under varying conditions, providing a safe operational limit for numerous applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient PCB layout and design flexibility, accommodating various placement options.

Terminal Form: GULL WING

Gull wing terminals enhance solder joint reliability and provide easier assembly processes for automated production lines.

Operating Mode: DUAL GATE, DEPLETION MODE

Dual gate operation offers better control over the transistor's performance and allows for applications requiring specific characteristics like frequency response.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

This capability enables use in high-frequency applications such as RF transmitters and receivers, making it a robust choice for advanced communication systems.

No. of Terminals: 4

A four-terminal configuration provides the necessary connections for operation while maintaining simplicity in design, reducing potential points of failure.

Package Style (Meter): SMALL OUTLINE

The small outline package style is designed for space-efficient layouts while facilitating better thermal management and performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology enhances switching speed and power efficiency, making it suitable for modern electronics applications.

Maximum Operating Temperature: 150 °C

A high operating temperature range allows for use in demanding environments, ensuring reliability under thermal stress.

Transistor Element Material: SILICON

Silicon as a material provides a good balance of performance and cost-effectiveness, making it a standard choice for many electronic components.

Maximum Drain Current (ID): 0.03 A

A maximum drain current of 0.03 A allows for moderate power handling, suitable for various low to medium power amplification tasks.

Terminal Position: DUAL

Dual terminal positions allow for flexible configuration in circuit designs, aiding in optimal layout and connectivity options.

Case Connection: SOURCE

Direct source connection enhances performance by minimizing parasitic inductance, improving overall signal integrity in the application.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF998R-TAPE-13 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF998R-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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