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BF990AR-TAPE-13

NXP Semiconductors

BF990AR-TAPE-13 by NXP Semiconductors

BF990AR-TAPE-13 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a max DS breakdown voltage of 18V, operates in dual gate depletion mode, and supports ultra-high frequency bands. This surface-mount transistor ensures reliable performance up to 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,780 parts In-Stock

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4,780

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Anansix

USA . 2,140 parts In-Stock

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2,140

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Vyrian

USA . 944 parts In-Stock

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944

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Native Components

USA . 435 parts In-Stock

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$0.949

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435

$0.949

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Northwest PG Solutions

USA . 13 parts In-Stock

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$1.044

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13

$1.044

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One Stop Electronics

USA . 1,262 parts In-Stock

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$18.050

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1,262

$18.050

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Corphita

USA . 775 parts In-Stock

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775

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UNI Independent Distributors

Spain . 268 parts In-Stock

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268

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Overview

Elevate your RF design projects with the BF990AR-TAPE-13 from NXP Semiconductors, a trusted leader in semiconductor innovation. This high-quality N-channel FET offers exceptional performance for amplifier applications, seamlessly handling ultra-high frequency signals. With its robust construction and reliable operation, you can count on enhanced efficiency and stability, ensuring your devices perform at their best. Choose NXP for unmatched quality and proven results that empower your technology to shine.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction provides durability and resistance to moisture, making it suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher electron mobility, leading to better performance characteristics for amplification applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances circuit protection and simplifies design by integrating essential functions into one package.

Transistor Application: AMPLIFIER

Designed specifically for amplification, making this FET ideal for audio, RF, or signal processing applications.

Surface Mount: YES

Surface mount technology allows for increased circuit density and faster assembly processes, saving space on PCBs.

Minimum DS Breakdown Voltage: 18 V

The 18V breakdown voltage ensures reliable operation in various circuit designs while providing sufficient protection against voltage spikes.

Package Shape: RECTANGULAR

Rectangular package shape aids in efficient layout design and space optimization in circuit board arrangements.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and provide better mechanical stability, enhancing the reliability of the connections.

Operating Mode: DUAL GATE, DEPLETION MODE

The dual gate design offers enhanced control over the conductivity of the transistor, enabling precise signal modulation.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating in the ultra-high frequency range makes this FET suitable for applications like RF amplification and communication systems.

No. of Terminals: 4

The compact 4-terminal design allows for straightforward connections while maximizing functionality in a small footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, allowing easier integration into compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology enables high input impedance and low power consumption, making this FET suitable for battery-operated devices.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C ensures reliable performance even in demanding thermal conditions.

Transistor Element Material: SILICON

Silicon as a substrate material offers excellent thermal stability and performance consistency, ensuring long-term operation.

Maximum Drain Current (ID): 0.03 A

With a maximum drain current of 0.03A, this FET is suitable for low-power applications where efficient current management is essential.

Terminal Position: DUAL

Dual terminal positioning allows for versatile circuit configurations and easier integration into varied designs.

Case Connection: SOURCE

Source case connection enhances routing flexibility in circuit board layouts, optimizing the overall design and performance.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF990AR-TAPE-13 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

18 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF990AR-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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