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BF998E6327HTSA1

Infineon Technologies

BF998E6327HTSA1 by Infineon Technologies

BF998E6327HTSA1 by Infineon Technologies is an N-CHANNEL RF FET with 12V DS Breakdown Voltage. Operating in DEPLETION MODE, it has ULTRA HIGH FREQUENCY BAND capabilities. This SMALL OUTLINE transistor is ideal for DUAL GATE applications in SOURCE connections.

Median Price

$0.130

Lifecycle Status

EOL

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5 parts In-Stock

1+ parts

$0.111

100+ parts

-

1k+ parts

-

10k+ parts

-

5

$0.111

-

-

-

Adafruit Industries

USA . 2,500 parts In-Stock

1+ parts

$0.843

100+ parts

$0.767

1k+ parts

$0.691

10k+ parts

-

2,500

$0.843

$0.767

$0.691

-

Farnell

UK . 10,909 parts In-Stock

1+ parts

-

100+ parts

$0.149

1k+ parts

$0.096

10k+ parts

$0.086

10,909

-

$0.149

$0.096

$0.086

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.090

10k+ parts

$0.088

9,000

-

-

$0.090

$0.088

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 222 parts In-Stock

1+ parts

$0.105

100+ parts

-

1k+ parts

-

10k+ parts

-

222

$0.105

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.441

100+ parts

-

1k+ parts

-

10k+ parts

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10

$0.441

-

-

-

Chip Stock

USA . 50,235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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50,235

-

-

-

-

Micros

Poland . 2,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.202

10k+ parts

$0.202

2,540

-

-

$0.202

$0.202

Vyrian

USA . 2,416 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,416

-

-

-

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VNN

France . 944 parts In-Stock

1+ parts

-

100+ parts

-

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944

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Euro-Tech

UK . 350 parts In-Stock

1+ parts

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100+ parts

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350

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Decca Corp

Germany . 3,013 parts In-Stock

1+ parts

$0.077

100+ parts

$0.075

1k+ parts

$0.075

10k+ parts

-

3,013

$0.077

$0.075

$0.075

-

Semicontronic

India . 2,984 parts In-Stock

1+ parts

$0.077

100+ parts

$0.075

1k+ parts

$0.075

10k+ parts

-

2,984

$0.077

$0.075

$0.075

-

Ampacity Inc.

Singapore . 2,776 parts In-Stock

1+ parts

$0.077

100+ parts

-

1k+ parts

-

10k+ parts

-

2,776

$0.077

-

-

-

Corphita

USA . 870 parts In-Stock

1+ parts

$0.100

100+ parts

-

1k+ parts

-

10k+ parts

-

870

$0.100

-

-

-

Argo Parts USA

USA . 3,868 parts In-Stock

1+ parts

$0.175

100+ parts

-

1k+ parts

-

10k+ parts

$0.170

3,868

$0.175

-

-

$0.170

Modulus Dynamics

Lithuania . 15,203 parts In-Stock

1+ parts

$0.563

100+ parts

$0.540

1k+ parts

$0.518

10k+ parts

-

15,203

$0.563

$0.540

$0.518

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$0.843

100+ parts

$0.767

1k+ parts

$0.691

10k+ parts

-

2,500

$0.843

$0.767

$0.691

-

Aztec Data Supply Inc.

USA . 4,092 parts In-Stock

1+ parts

$0.954

100+ parts

-

1k+ parts

-

10k+ parts

-

4,092

$0.954

-

-

-

Corohmni

South Africa . 57 parts In-Stock

1+ parts

$1.286

100+ parts

-

1k+ parts

-

10k+ parts

-

57

$1.286

-

-

-

AZTECH Wire

Italy . 166 parts In-Stock

1+ parts

$13.470

100+ parts

-

1k+ parts

-

10k+ parts

-

166

$13.470

-

-

-

Andel Nordic

Denmark . 478 parts In-Stock

1+ parts

$15.660

100+ parts

-

1k+ parts

$10.959

10k+ parts

$10.959

478

$15.660

-

$10.959

$10.959

Eastek

USA . 459,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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459,000

-

-

-

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Perfect Parts

USA . 112,687 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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112,687

-

-

-

-

RC Electronics

USA . 81,802 parts In-Stock

1+ parts

-

100+ parts

$0.250

1k+ parts

$0.230

10k+ parts

$0.220

81,802

-

$0.250

$0.230

$0.220

Continental Prestige Electronics

USA . 22,970 parts In-Stock

1+ parts

-

100+ parts

$0.211

1k+ parts

$0.153

10k+ parts

$0.123

22,970

-

$0.211

$0.153

$0.123

Robosynatics

Brazil . 20,738 parts In-Stock

1+ parts

-

100+ parts

$1.875

1k+ parts

$1.836

10k+ parts

$1.836

20,738

-

$1.875

$1.836

$1.836

Lucentia Tech

USA . 20,738 parts In-Stock

1+ parts

-

100+ parts

$1.875

1k+ parts

$1.836

10k+ parts

$1.836

20,738

-

$1.875

$1.836

$1.836

QUARKTWIN TECHNOLOGY LTD

USA . 10,315 parts In-Stock

1+ parts

-

100+ parts

-

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10,315

-

-

-

-

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,100 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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2,100

-

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.433

1k+ parts

$0.419

10k+ parts

$0.411

1,000

-

$0.433

$0.419

$0.411

Overview

Experience high-quality performance with the BF998E6327HTSA1 by Infineon Technologies, a leading manufacturer in the semiconductor industry. This RF Small Signal Field Effect Transistor (FET) offers unparalleled reliability and efficiency in a variety of applications. From its N-CHANNEL configuration to its ultra-high frequency band capabilities, this transistor delivers exceptional value and benefits to customers looking for top-notch performance. Trust in the expertise of Infineon Technologies and elevate your projects with the BF998E6327HTSA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer high conductivity and switching speeds, making them suitable for high-frequency applications.

Configuration: SINGLE

The single configuration simplifies circuit design and integration, making it easy to use in various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, saving space and reducing overall system size.

Minimum DS Breakdown Voltage: 12 V

The minimum breakdown voltage of 12V makes it suitable for low voltage applications, ensuring safe operation.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and mounting on the PCB, optimizing space utilization.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and facilitates soldering, ensuring reliable performance.

Operating Mode: DUAL GATE, DEPLETION MODE

The dual gate, depletion mode operation allows for precise control and enhanced performance in RF signal applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

The ultra high frequency band capability enables high-speed data transmission and superior signal quality.

No. of Elements: 1

The single element design simplifies circuit complexity and enhances reliability in small signal applications.

No. of Terminals: 4

The four terminals provide ample connection options and flexibility in circuit design and layout.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers compactness and space savings, ideal for portable and space-constrained devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology ensures high performance and efficiency in signal amplification and processing.

Transistor Element Material: SILICON

Silicon as the transistor element material provides reliability, stability, and consistent performance over a wide range of operating conditions.

Terminal Finish: TIN

The tin terminal finish offers good electrical conductivity and corrosion resistance, ensuring long-term reliability in various environments.

Maximum Drain Current (ID): 0.03 A

The maximum drain current of 0.03A allows for efficient power handling and reliable operation in small signal applications.

Terminal Position: DUAL

The dual terminal position enhances flexibility in circuit connection and layout, enabling versatile use in different applications.

Moisture Sensitivity Level (MSL): 1

The MSL level 1 ensures resistance to moisture and environmental conditions, maintaining performance and reliability over time.

Case Connection: SOURCE

The source case connection provides easy grounding and thermal dissipation, ensuring stable operation and longevity of the FET.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF998E6327HTSA1 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

BF998E6327HTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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