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BF998,215

NXP Semiconductors

BF998,215 by NXP Semiconductors

BF998,215 by NXP Semiconductors is an N-CHANNEL RF FET with a 12V DS Breakdown Voltage. It operates in the ULTRA HIGH FREQ BAND and has a 0.03A Drain Current. Ideal for AMPLIFIER applications, this transistor features DUAL GATE DEPLETION MODE and a max power dissipation of 0.2W.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Vyrian

USA . 6,271 parts In-Stock

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Anansix

USA . 1,389 parts In-Stock

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Digiode

USA . 1,382 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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VNN

France . 9 parts In-Stock

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Corohmni

South Africa . 204 parts In-Stock

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$0.788

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Aztec Data Supply Inc.

USA . 2,567 parts In-Stock

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$1.160

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Semicontronic

India . 858 parts In-Stock

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$16.050

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$15.649

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$15.568

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858

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AZTECH Wire

Italy . 731 parts In-Stock

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$19.609

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One Stop Electronics

USA . 1,362 parts In-Stock

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$33.050

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Continental Prestige Electronics

USA . 6,578 parts In-Stock

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Corphita

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Argo Parts USA

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UNI Independent Distributors

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Microchip USA

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Overview

Discover the BF998,215 by NXP Semiconductors, a cutting-edge RF Small Signal Field Effect Transistor designed for high-performance amplifier applications. With N-CHANNEL polarity and a single configuration with a built-in diode, this transistor offers unparalleled reliability and efficiency. Ideal for ultra-high frequency bands, this transistor boasts a maximum power dissipation of 0.2W and a minimum DS breakdown voltage of 12V. Trust NXP Semiconductors for top-quality components that deliver exceptional value and performance, making your projects shine brighter than ever before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package material makes the transistor lightweight and durable, suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have better performance and efficiency compared to P-Channel transistors, making this a good choice for amplifier applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the transistor from reverse voltage, enhancing its reliability and longevity in amplifier circuits.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance and efficiency in amplifying signals.

Surface Mount: YES

The surface mount feature allows for easy and efficient integration onto circuit boards, saving space and simplifying the manufacturing process.

Minimum DS Breakdown Voltage: 12 V

The minimum breakdown voltage of 12V ensures that the transistor can withstand high voltages, making it suitable for various amplifier applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and space-saving design, ideal for applications where space is limited.

Terminal Form: GULL WING

The gull-wing terminal form offers secure and reliable connections to the circuit board, ensuring stable performance in amplifier circuits.

Operating Mode: DUAL GATE, DEPLETION MODE

The dual gate depletion mode operation allows for precise control over the transistor's performance, enhancing its efficiency in amplifier applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency bands, this transistor is suitable for high-performance amplifier applications where high-frequency signals are involved.

Maximum Drain Current (Abs) (ID): 0.03 A

With a maximum drain current of 0.03A, this transistor can handle moderate current loads, making it suitable for amplifier circuits with varying power requirements.

No. of Terminals: 4

The 4 terminals provide sufficient connections for input and output signals, as well as power supply, in amplifier circuits.

Maximum Power Dissipation (Abs): 0.2 W

The maximum power dissipation of 0.2W ensures that the transistor can handle moderate power levels without overheating, ensuring reliable performance in amplifier applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers a compact and lightweight design, ideal for applications where size and weight are critical factors.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The Metal-Oxide Semiconductor technology used in this transistor provides high-performance characteristics, making it suitable for demanding amplifier applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high-temperature environments, ensuring reliable performance in amplifier applications.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its high-performance characteristics, making this transistor a reliable choice for amplifier applications.

Terminal Finish: TIN

The tin terminal finish offers good solderability and corrosion resistance, ensuring stable connections in amplifier circuits.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit design, allowing for various connection configurations in amplifier applications.

Case Connection: SOURCE

The source case connection ensures proper grounding and stable operation in amplifier circuits, minimizing noise and interference.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliable connections during manufacturing.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this transistor can withstand high-temperature soldering processes, ensuring quality assembly in amplifier circuits.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF998,215 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (Abs) (ID):

.03 A

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF998,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.75

SB

8541.21.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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