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BF998R,215

NXP Semiconductors

BF998R,215 by NXP Semiconductors

NXP Semiconductors' BF998R,215 is an N-CHANNEL RF FET with a built-in diode for AMPLIFIER applications. Operating in DEPLETION MODE, it offers a 12V DS Breakdown Voltage and 0.03A Drain Current. With GULL WING terminals and ULTRA HIGH FREQUENCY capabilities, it's ideal for small outline designs in SOURCE connections.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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VNN

France . 17,725 parts In-Stock

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Cogito LLC

Ukraine . 9,000 parts In-Stock

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Vyrian

USA . 5,988 parts In-Stock

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Digiode

USA . 4,466 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Anansix

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240

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Aztec Data Supply Inc.

USA . 2,426 parts In-Stock

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$0.570

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Corohmni

South Africa . 218 parts In-Stock

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$0.726

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AZTECH Wire

Italy . 281 parts In-Stock

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$14.749

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Semicontronic

India . 389 parts In-Stock

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$43.050

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$41.974

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$41.758

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Ampacity Inc.

Singapore . 828 parts In-Stock

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$60.050

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One Stop Electronics

USA . 321 parts In-Stock

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Perfect Parts

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UNI Independent Distributors

Spain . 5,049 parts In-Stock

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Corphita

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Continental Prestige Electronics

USA . 1,455 parts In-Stock

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Kepictronics

USA . 569 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 417 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Discover the BF998R,215 by NXP Semiconductors, a top-quality RF Small Signal Field Effect Transistor that promises unparalleled performance in amplifier applications. With its N-CHANNEL configuration and built-in diode, this transistor operates in dual gate depletion mode within the ultra-high-frequency band, ensuring optimal functionality. Its compact design and high power dissipation make it a reliable choice for various electronic projects. Experience seamless integration and superior results with the BF998R,215 - the ultimate solution for your amplification needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body ensures durability and reliability, making it a good choice for long-lasting performance.

Polarity or Channel Type: N-CHANNEL

N-channel polarity allows for efficient signal amplification, making this FET a great choice for amplifier applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this single configuration FET simplifies circuit design and saves space, making it a convenient option.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this FET offers high performance and excellent signal amplification capabilities.

Surface Mount: YES

The surface mount capability of this FET makes it easy to integrate into circuit boards, saving time and effort during assembly.

Minimum DS Breakdown Voltage: 12 V

With a minimum breakdown voltage of 12V, this FET provides reliable operation and protection against voltage surges.

Package Shape: RECTANGULAR

The rectangular package shape of this FET allows for easy integration into circuit layouts and provides a compact footprint for space-saving applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF998R,215 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (Abs) (ID):

.03 A

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF998R,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.75

SB

8541.21.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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