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2N4220

Texas Instruments

2N4220 by Texas Instruments

2N4220 by Texas Instruments is an N-CHANNEL RF FET with 30V DS Breakdown Voltage. Ideal for SWITCHING applications, it operates in DEPLETION MODE with 0.3W Power Dissipation and 200°C Max Temp. Features include 4 terminals, SILICON element material, and 2pF Crss feedback capacitance.

Median Price

$32.750

Lifecycle Status

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In-Stock Inventory

1k+

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Mouser Electronics

USA . 24 parts In-Stock

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$32.750

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$22.660

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American Microsemiconductor Inc.

USA . 477 parts In-Stock

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Forefront Electronics and Design

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Digiode

USA . 4,761 parts In-Stock

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Vyrian

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Anansix

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Kruse Electronics AG

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Kruse

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ECAB

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Manoshevitz Elec. Sales

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M&R Communications

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ICP Electronique

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First Choice Components Inc.

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Corel Iberica Componentes, S.L.

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Resion

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LittleDiode

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R&J Components

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Electronic Expediters

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Mil-Aero Solutions, Inc.

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ChromeModa Solutions

Germany . 472 parts In-Stock

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$0.318

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$0.261

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IDEA Electronic Components Group

UK . 2,678 parts In-Stock

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$1.406

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DigiPath Technology Company

USA . 1,644 parts In-Stock

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MKK Technologies

India . 814 parts In-Stock

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Corphita

USA . 11,845 parts In-Stock

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UNI Independent Distributors

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Supply Digital

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Northwest PG Solutions

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Parana Technologies

USA . 1,997 parts In-Stock

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Glotronic Ltd.

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RTC Component Inc.

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Overview

Elevate your RF signal applications with the high-quality 2N4220 by Texas Instruments. Crafted with precision and expertise, this N-channel FET delivers reliable performance in switching operations. Its robust construction and efficient design make it a valuable asset for your projects. Trust in Texas Instruments' reputation for excellence and unlock new possibilities with the 2N4220. Experience seamless operation and enhanced functionality with this versatile component.

Feature Benefit Bullets

Package Body Material: METAL

Metal package body provides good thermal conductivity and durability, making the transistor suitable for high-power applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility and faster switching speeds compared to P-channel transistors, making them ideal for switching applications.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this transistor can handle higher voltages without breakdown, ensuring reliability in various applications.

Configuration: SINGLE

Single configuration simplifies circuit design and integration, making it easier to implement the transistor in different electronic systems.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and low power dissipation, making it efficient for switching circuits.

Maximum Power Dissipation (Abs): 0.3 W

With a maximum power dissipation of 0.3W, this transistor can handle moderate power levels without overheating, ensuring reliable operation.

Maximum Operating Temperature: 200 °C

Operating temperature of 200°C allows the transistor to be used in high-temperature environments, expanding its range of applications.

Maximum Drain Current (ID): 0.015 A

With a maximum drain current of 0.015A, this transistor can handle moderate current levels, making it suitable for low-power applications.

Maximum Feedback Capacitance (Crss): 2 pF

Low feedback capacitance helps reduce signal distortion and ensures better high-frequency performance in amplifier circuits.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) 2N4220 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Texas Instruments

Specs

Case Connection:

ISOLATED

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.015 A

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

2 pF

JEDEC-95 Code:

TO-72

JESD-30 Code:

O-MBCY-W4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Form:

WIRE

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

2N4220 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-00-409-5497, 5961004095497, 5961-00-501-1104, 5961005011104, 5961-00-083-2688, 5961000832688, 5961-01-266-7905, 5961012667905, 5961-14-311-5761, 5961143115761

NIIN

004095497, 005011104, 000832688, 012667905, 143115761

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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