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MMBFJ309

Onsemi

MMBFJ309 by Onsemi

The Onsemi MMBFJ309 is an N-CHANNEL RF FET with a 25V DS breakdown voltage, ideal for AMPLIFIER applications in the ULTRA HIGH FREQUENCY BAND. It features a PLASTIC/EPOXY package, GULL WING terminals, and operates in DEPLETION MODE at up to 150 °C.

Median Price

$0.520

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 947 parts In-Stock

1+ parts

$0.130

100+ parts

$0.130

1k+ parts

$0.120

10k+ parts

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947

$0.130

$0.130

$0.120

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DigiKey

USA . 71,498 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.910

10k+ parts

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71,498

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-

$0.910

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Flip Electronics (Authorized)

USA . 71,498 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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71,498

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Distributors (In-Stock)

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Digiode

USA . 1,919 parts In-Stock

1+ parts

$0.124

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1,919

$0.124

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Vyrian

USA . 2,716 parts In-Stock

1+ parts

$0.130

100+ parts

-

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2,716

$0.130

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Flip Electronics

USA . 71,498 parts In-Stock

1+ parts

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71,498

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DigiKey Marketplace

USA . 71,498 parts In-Stock

1+ parts

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71,498

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Bristol Electronics

USA . 7,682 parts In-Stock

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7,682

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Avant Electronics Limited

UK . 4,100 parts In-Stock

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4,100

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ComSIT Distribution GmbH

Germany . 2,100 parts In-Stock

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2,100

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Anansix

USA . 1,934 parts In-Stock

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1,934

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Distributors (Availability)

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Ampacity Inc.

Singapore . 47,871 parts In-Stock

1+ parts

$0.111

100+ parts

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47,871

$0.111

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Corphita

USA . 2,501 parts In-Stock

1+ parts

$0.117

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2,501

$0.117

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Corohmni

South Africa . 385 parts In-Stock

1+ parts

$0.130

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385

$0.130

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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90,000

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QUARKTWIN TECHNOLOGY LTD

USA . 22,372 parts In-Stock

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22,372

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Perfect Parts

USA . 16,437 parts In-Stock

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16,437

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Microchip USA

USA . 9,058 parts In-Stock

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9,058

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TANS Electronics

Latvia . 6,891 parts In-Stock

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6,891

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Problanco Electronics

Mexico . 3,361 parts In-Stock

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3,361

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Kulean Microsystems

USA . 3,138 parts In-Stock

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3,138

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SupplyDigital Components

Austria . 3,133 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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1,800

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Supply Digital

USA . 1,187 parts In-Stock

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1,187

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UHIMA Technologies

Türkiye . 963 parts In-Stock

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963

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Overview

Enhance your electronic designs with the MMBFJ309 by Onsemi. This RF Small Signal Field Effect Transistor offers unparalleled quality and reliability, thanks to Onsemi's reputation as a leading manufacturer in the industry. Ideal for amplifier applications, this N-CHANNEL transistor operates in depletion mode and is designed for ultra-high frequency bands. With its small outline package and gull wing terminals, this transistor provides easy integration into your projects. Experience the benefits of superior performance and efficiency with the MMBFJ309, setting you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the delicate transistor components.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are commonly used in amplifiers and offer high input impedance and low output impedance, making them suitable for various applications.

Surface Mount: YES

Being surface mountable makes this transistor easy to integrate into compact electronic designs, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25 V, this transistor can handle high voltage applications with reliable performance.

Operating Mode: DEPLETION MODE

Depletion mode transistors are capable of conducting when no voltage is applied to the gate, allowing for versatile circuit design options.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating in the ultra-high frequency band, this transistor is suitable for high-speed signal processing applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high temperatures without compromising performance.

Field Effect Transistor Technology: JUNCTION

Junction FET technology offers high input impedance and low output impedance, making this transistor ideal for amplifier applications.

Maximum Feedback Capacitance (Crss): 2.5 pF

The low feedback capacitance of 2.5 pF helps minimize signal distortion and maintain signal integrity in high-frequency applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) MMBFJ309 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

2.5 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MMBFJ309 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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