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MMBF5484LT1G

Onsemi

MMBF5484LT1G by Onsemi

MMBF5484LT1G by Onsemi is an N-CHANNEL RF FET with 16 dB Gp for AMPLIFIER applications. Operating in DEPLETION MODE, it offers a very high frequency band and 3 terminals. With a max power dissipation of 0.225 W, this JUNCTION FET has a temp range of -55 to 150 °C.

Median Price

$0.132

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 347 parts In-Stock

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-

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$0.132

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$0.110

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$0.098

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$0.098

Adafruit Industries

USA . 100 parts In-Stock

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Digiode

USA . 1,119 parts In-Stock

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$0.103

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Chip Stock

USA . 76,860 parts In-Stock

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Vyrian

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Nova Conductors

Japan . 700 parts In-Stock

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Inventory MP

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Bristol Electronics

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Ampacity Inc.

Singapore . 224 parts In-Stock

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$0.092

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224

$0.092

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Semicontronic

India . 224 parts In-Stock

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$0.092

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$0.090

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$0.089

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224

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$0.089

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Corphita

USA . 1,935 parts In-Stock

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$0.097

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Corohmni

South Africa . 298 parts In-Stock

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$0.108

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Aztec Data Supply Inc.

USA . 4,393 parts In-Stock

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$1.955

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AZTECH Wire

Italy . 740 parts In-Stock

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$6.405

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QUARKTWIN TECHNOLOGY LTD

USA . 13,810 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,864 parts In-Stock

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Perfect Parts

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Kulean Microsystems

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TANS Electronics

Latvia . 5,788 parts In-Stock

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Argo Parts USA

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SupplyDigital Components

Austria . 3,247 parts In-Stock

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Metaverse IC Inc.

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Continental Prestige Electronics

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Problanco Electronics

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UHIMA Technologies

Türkiye . 791 parts In-Stock

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Bastille Electronics

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Overview

Discover the power of the MMBF5484LT1G by Onsemi, a top-tier manufacturer known for delivering high-quality RF Small Signal Field Effect Transistors. Perfect for amplifier applications, this N-CHANNEL transistor operates in the very high-frequency band with a power gain of 16 dB. With a durable plastic/epoxy package and gull wing terminals, this transistor offers superior performance and reliability. Elevate your projects with the MMBF5484LT1G and experience the benefits of Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the transistor lightweight and durable.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors generally have better performance characteristics compared to P-Channel transistors, making this product a good choice for various applications.

Configuration: SINGLE

A single configuration simplifies the design and integration of this transistor in amplifier circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in amplifying signals.

Surface Mount: YES

Surface mount design allows for easy and compact integration on PCBs, making it suitable for modern electronic devices.

Minimum Power Gain (Gp): 16 dB

With a minimum power gain of 16 dB, this transistor provides efficient signal amplification.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows for reliable performance in various operating conditions.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) MMBF5484LT1G attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

1 pF

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

.225 W

Maximum Power Dissipation (Abs):

Minimum Power Gain (Gp):

16 dB

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MMBF5484LT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.95

SB

8541.21.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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