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MMBF5484LT1

Onsemi

MMBF5484LT1 by Onsemi

Onsemi's MMBF5484LT1 is an N-CHANNEL RF FET with 16 dB Gp for AMPLIFIER applications. Operating in DEPLETION MODE, it offers a very high frequency band and can handle up to 0.225 W power dissipation. With a small outline package style, it has a max operating temperature of 150°C.

Median Price

$0.815

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Adafruit Industries

USA . 600 parts In-Stock

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Component Electronics Inc.

Canada . 84,000 parts In-Stock

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$1.540

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USA . 76,710 parts In-Stock

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Infinite Electronics LLP

India . 6,000 parts In-Stock

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Vyrian

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Semi Source

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Inventory MP

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Bristol Electronics

USA . 2,193 parts In-Stock

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Component Sense

UK . 1,762 parts In-Stock

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$0.090

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Legend Electronics Inc.

USA . 1,683 parts In-Stock

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Digiode

USA . 1,081 parts In-Stock

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A&K Electronics

USA . 1,000 parts In-Stock

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Mil-Aero Solutions, Inc.

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PC Components Company LLC

USA . 944 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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Microfarads

USA . 123 parts In-Stock

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Corohmni

South Africa . 466 parts In-Stock

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$0.090

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466

$0.090

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Aztec Data Supply Inc.

USA . 3,264 parts In-Stock

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$1.924

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AZTECH Wire

Italy . 391 parts In-Stock

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$7.917

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Ampacity Inc.

Singapore . 362 parts In-Stock

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$13.050

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Semicontronic

India . 172 parts In-Stock

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$13.050

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$12.724

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$12.658

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QUARKTWIN TECHNOLOGY LTD

USA . 24,263 parts In-Stock

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Kulean Microsystems

USA . 6,618 parts In-Stock

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SupplyDigital Components

Austria . 6,604 parts In-Stock

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Metaverse IC Inc.

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Problanco Electronics

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Continental Prestige Electronics

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Perfect Parts

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TANS Electronics

Latvia . 3,064 parts In-Stock

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Argo Parts USA

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Advanced Electronics

New Zealand . 600 parts In-Stock

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UHIMA Technologies

Türkiye . 250 parts In-Stock

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Bastille Electronics

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Corphita

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Overview

Upgrade your RF amplifier circuits with the MMBF5484LT1 by Onsemi. Known for their top-notch manufacturing quality, Onsemi delivers reliable and high-performance RF Small Signal Field Effect Transistors (FET) like no other. This N-CHANNEL FET offers exceptional power gain, very high frequency band operation, and a small outline package for easy integration. Whether you're in need of amplifying signals or boosting performance in your electronic projects, this transistor is the perfect choice. Trust in Onsemi's expertise and elevate your designs with the MMBF5484LT1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have higher mobility and conductivity, making them suitable for high frequency applications.

Configuration: SINGLE

Single configuration simplifies the design and integration process, making it easier to use in various amplifier applications.

Minimum Power Gain (Gp): 16 dB

With a minimum power gain of 16 dB, this transistor can amplify signals effectively without significant signal loss.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in signal amplification.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB mounting, saving space and simplifying assembly.

Maximum Operating Temperature: 150 °C

With a high operating temperature range of 150°C, this transistor can withstand high operational demands and environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and reliability for the transistor's connections.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) MMBF5484LT1 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

1 pF

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

.225 W

Maximum Power Dissipation (Abs):

Minimum Power Gain (Gp):

16 dB

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MMBF5484LT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.95

SB

8541.21.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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