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MMBFJ310LT3G

Onsemi

MMBFJ310LT3G by Onsemi

MMBFJ310LT3G by Onsemi is an N-CHANNEL RF FET with 25V DS Breakdown Voltage. Ideal for AMPLIFIER applications, it operates in DEPLETION MODE at up to 150°C. With a max power dissipation of 0.225W, this transistor offers ultra-high frequency performance in a small outline package.

Median Price

$0.156

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 189,013 parts In-Stock

1+ parts

$0.230

100+ parts

$0.099

1k+ parts

$0.086

10k+ parts

$0.081

189,013

$0.230

$0.099

$0.086

$0.081

DigiKey

USA . 12,138 parts In-Stock

1+ parts

$0.230

100+ parts

$0.120

1k+ parts

$0.100

10k+ parts

$0.087

12,138

$0.230

$0.120

$0.100

$0.087

Newark

USA . 3,044 parts In-Stock

1+ parts

$0.262

100+ parts

$0.149

1k+ parts

$0.129

10k+ parts

-

3,044

$0.262

$0.149

$0.129

-

Adafruit Industries

USA . 100 parts In-Stock

1+ parts

$0.409

100+ parts

$0.388

1k+ parts

$0.388

10k+ parts

-

100

$0.409

$0.388

$0.388

-

Flip Electronics (Authorized)

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30,000

-

-

-

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Master Electronics

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.074

10k+ parts

$0.071

10,000

-

-

$0.074

$0.071

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.095

10k+ parts

$0.086

10,000

-

-

$0.095

$0.086

RS (Exports)

UK . 7,940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.091

7,940

-

-

-

$0.091

Farnell

UK . 3,069 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.085

10k+ parts

$0.072

3,069

-

$0.119

$0.085

$0.072

Element14

Singapore . 3,069 parts In-Stock

1+ parts

-

100+ parts

$0.156

1k+ parts

$0.123

10k+ parts

$0.119

3,069

-

$0.156

$0.123

$0.119

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.169

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$0.169

-

-

-

Digiode

USA . 1,931 parts In-Stock

1+ parts

$0.342

100+ parts

-

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-

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1,931

$0.342

-

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Vyrian

USA . 31,066 parts In-Stock

1+ parts

-

100+ parts

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31,066

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Flip Electronics

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

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30,000

-

-

-

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IBS Electronics

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.104

10k+ parts

$0.097

10,000

-

-

$0.104

$0.097

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 31,284 parts In-Stock

1+ parts

$0.060

100+ parts

-

1k+ parts

-

10k+ parts

-

31,284

$0.060

-

-

-

Semicontronic

India . 31,270 parts In-Stock

1+ parts

$0.070

100+ parts

$0.068

1k+ parts

$0.068

10k+ parts

-

31,270

$0.070

$0.068

$0.068

-

Corohmni

South Africa . 180 parts In-Stock

1+ parts

$0.086

100+ parts

-

1k+ parts

-

10k+ parts

-

180

$0.086

-

-

-

Argo Parts USA

USA . 4,995 parts In-Stock

1+ parts

$0.169

100+ parts

-

1k+ parts

-

10k+ parts

$0.164

4,995

$0.169

-

-

$0.164

Corphita

USA . 1,757 parts In-Stock

1+ parts

$0.324

100+ parts

-

1k+ parts

-

10k+ parts

-

1,757

$0.324

-

-

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$0.409

100+ parts

$0.388

1k+ parts

$0.388

10k+ parts

-

100

$0.409

$0.388

$0.388

-

Aztec Data Supply Inc.

USA . 4,830 parts In-Stock

1+ parts

$1.522

100+ parts

-

1k+ parts

-

10k+ parts

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4,830

$1.522

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 20,919 parts In-Stock

1+ parts

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20,919

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Continental Prestige Electronics

USA . 9,179 parts In-Stock

1+ parts

-

100+ parts

$0.194

1k+ parts

$0.120

10k+ parts

$0.097

9,179

-

$0.194

$0.120

$0.097

SupplyDigital Components

Austria . 4,544 parts In-Stock

1+ parts

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4,544

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TANS Electronics

Latvia . 2,414 parts In-Stock

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2,414

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Problanco Electronics

Mexico . 2,005 parts In-Stock

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2,005

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 776 parts In-Stock

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776

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Kulean Microsystems

USA . 758 parts In-Stock

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758

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Perfect Parts

USA . 560 parts In-Stock

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560

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Robosynatics

Brazil . 150 parts In-Stock

1+ parts

-

100+ parts

$6.012

1k+ parts

$6.012

10k+ parts

$6.012

150

-

$6.012

$6.012

$6.012

Lucentia Tech

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$6.012

1k+ parts

$6.012

10k+ parts

$6.012

150

-

$6.012

$6.012

$6.012

Overview

Unlock the power of innovation with the MMBFJ310LT3G by Onsemi. This RF small signal field effect transistor offers superior quality and reliability, backed by the reputable manufacturer Onsemi. Ideal for amplifier applications in the ultra-high-frequency band, this N-channel transistor provides exceptional performance in a compact package. Experience the benefits of high power dissipation, low feedback capacitance, and efficient operation in depletion mode. Elevate your projects with the MMBFJ310LT3G and unleash the full potential of your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-resistance and higher electron mobility, making them ideal for high-performance amplifier applications.

Configuration: SINGLE

Single configuration simplifies circuit design and integration, making it easier to use in amplifier applications.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring high performance and efficiency in signal amplification.

Surface Mount: YES

Surface mount capability allows for easy and efficient soldering onto circuit boards, making it suitable for compact and space-constrained designs.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this transistor can handle higher voltages, providing reliability and robustness in amplifier circuits.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy and secure mounting onto circuit boards, ensuring stability and reliability in amplifier applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and secure connections, enhancing the overall performance and longevity of the transistor.

Operating Mode: DEPLETION MODE

Depletion mode operation offers precise control over the transistor's conductivity, allowing for accurate signal amplification in amplifier circuits.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra high frequency band applications, providing excellent amplification of high-frequency signals with minimal distortion.

No. of Terminals: 3

Three terminals enable easy connection to external circuitry, simplifying the integration of the transistor into amplifier designs.

Maximum Power Dissipation (Abs): 0.225 W

With a maximum power dissipation of 0.225W, this transistor can handle high power levels, ensuring stable and reliable performance in amplifier circuits.

Package Style (Meter): SMALL OUTLINE

Small outline package style offers compact size and space-saving design, making it suitable for high-density amplifier circuit applications.

Field Effect Transistor Technology: JUNCTION

Junction FET technology provides high gain and low noise performance, making it a reliable choice for amplifier applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high-temperature environments, ensuring reliable performance in amplifier circuits.

Transistor Element Material: SILICON

Silicon material provides high reliability and performance, making it suitable for demanding amplifier applications that require long-term stability.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers excellent solderability and corrosion resistance, ensuring stable and secure connections in amplifier circuits.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options and easy integration into amplifier circuit designs, enhancing flexibility and usability.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, this transistor can withstand reflow soldering processes without compromising its performance.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper soldering and bonding, providing reliable connections for stable performance in amplifier applications.

Maximum Feedback Capacitance (Crss): 2.5 pF

Low feedback capacitance of 2.5pF minimizes signal distortion and ensures high stability in amplifier circuits, making it an ideal choice for high-frequency applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) MMBFJ310LT3G attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

2.5 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MMBFJ310LT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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