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BF901-TAPE-13

NXP Semiconductors

BF901-TAPE-13 by NXP Semiconductors

BF901-TAPE-13 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a 12V min DS breakdown voltage, operates in the ultra-high frequency band, and supports dual gate enhancement mode. This compact surface mount device ensures reliable performance up to 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,206 parts In-Stock

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2,206

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Anansix

USA . 700 parts In-Stock

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700

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Vyrian

USA . 450 parts In-Stock

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450

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Distributors (Availability)

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Native Components

USA . 145 parts In-Stock

1+ parts

$6.589

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145

$6.589

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One Stop Electronics

USA . 1,526 parts In-Stock

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$45.050

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1,526

$45.050

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UNI Independent Distributors

Spain . 7,999 parts In-Stock

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7,999

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Northwest PG Solutions

USA . 683 parts In-Stock

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$6.457

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683

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$6.457

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Corphita

USA . 449 parts In-Stock

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449

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Overview

Unlock the power of innovation with the BF901-TAPE-13 from NXP Semiconductors, a leader in cutting-edge technology. This high-performance RF small signal FET excels in applications requiring precision amplification, delivering exceptional reliability and efficiency. With its compact design and enhanced capabilities, it’s perfect for modern electronics, ensuring optimal performance in ultra-high frequency scenarios. Choose NXP for unmatched quality and elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and stability in various environments, making the product suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer lower on-state resistance and higher efficiency, making them ideal for amplifier applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides protection against inductive kickbacks, enhancing reliability in circuit designs.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET is optimized for high performance in audio and RF applications.

Surface Mount: YES

Surface mount technology allows for easier integration into compact circuit designs, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 12 V

A moderate breakdown voltage provides flexibility in various applications while ensuring protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space usage on printed circuit boards, aiding in compact design.

Terminal Form: GULL WING

Gull wing terminals enhance solderability and secure mounting, improving the overall reliability of the product.

Operating Mode: DUAL GATE, ENHANCEMENT MODE

The dual gate functionality allows for better control of the amplifier's gain, making it versatile for different audio signals.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Suitable for ultra high frequency applications, this FET can be used in advanced communication systems and radar technology.

No. of Terminals: 4

A 4-terminal design offers simplicity in connections and greater flexibility for circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package allows for higher density and minimizes the footprint on PCB layouts, making it ideal for modern applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology contributes to lower power consumption and higher efficiency, making this FET suitable for energy-sensitive applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature limit, this FET can function effectively in harsh environments.

Transistor Element Material: SILICON

Silicon material ensures well-established electrical performance and reliability, making it a standard choice for transistors.

Maximum Drain Current (ID): 0.03 A

A maximum drain current of 0.03 A allows for efficient handling of small to moderate signals, suitable for various applications.

Terminal Position: DUAL

The dual terminal positioning provides ease of connectivity and simplifies design integration.

Case Connection: SOURCE

A source case connection ensures optimal thermal management, enhancing the overall efficiency and performance of the FET.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF901-TAPE-13 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF901-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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