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MMBFJ309LT1

Onsemi

MMBFJ309LT1 by Onsemi

MMBFJ309LT1 by Onsemi is an N-CHANNEL RF FET with 25V DS Breakdown Voltage. Ideal for AMPLIFIER applications, it operates in DEPLETION MODE at 150 °C max temp. Featuring ULTRA HIGH FREQUENCY BAND, it has a max power dissipation of 0.225W in a SMALL OUTLINE package.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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J2 Sourcing AB

Sweden . 3,498 parts In-Stock

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Bristol Electronics

USA . 2,845 parts In-Stock

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ACDS - Activité Composants Distribution Service

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PC Components Company LLC

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Vyrian

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R&J Components

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Flex Direct, LLC

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Microfarads

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Digiode

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Resion

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Distributors (Availability)

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Component Stockers USA

USA . 413 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 11,494 parts In-Stock

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Perfect Parts

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Kulean Microsystems

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 2,903 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2,526 parts In-Stock

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Glotronic Ltd.

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TANS Electronics

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Assy Fe

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Metaverse IC Inc.

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Problanco Electronics

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SupplyDigital Components

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Futuretech Components

Singapore . 965 parts In-Stock

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Corphita

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Corohmni

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Kepictronics

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UHIMA Technologies

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Overview

Unlock the power of advanced technology with the MMBFJ309LT1 by Onsemi. Crafted with precision and expertise, this RF Small Signal Field Effect Transistor offers unparalleled performance for amplifier applications in the ultra-high-frequency band. With a durable plastic/epoxy package and N-channel configuration, this single-channel transistor ensures reliable operation at temperatures up to 150 °C. Experience superior quality and seamless functionality with Onsemi's MMBFJ309LT1, delivering unmatched value and benefits to amplify your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy, the package is durable and lightweight, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility, allowing for faster switching speeds and better performance in high frequency applications.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor is optimized for amplifying small signals efficiently.

Surface Mount: YES

Being surface mountable, this transistor is easy to integrate onto circuit boards, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this transistor can handle higher voltages without getting damaged, increasing its reliability.

Maximum Power Dissipation (Abs): 0.225 W

Capable of dissipating up to 0.225W of power, this transistor can operate efficiently without overheating.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150 °C, this transistor can withstand elevated temperatures without compromising performance.

Maximum Feedback Capacitance (Crss): 2.5 pF

Having a low feedback capacitance of 2.5pF, this transistor can minimize signal distortions and improve overall performance in high frequency applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) MMBFJ309LT1 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

2.5 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MMBFJ309LT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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