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BF245ZL1

Onsemi

BF245ZL1 by Onsemi

BF245ZL1 by Onsemi is an N-CHANNEL FET with 30V DS Breakdown Voltage. It operates in DEPLETION MODE for AMPLIFIER applications at ULTRA HIGH FREQUENCY BAND. This THROUGH-HOLE transistor has a max ID of 0.1A and comes in a CYLINDRICAL package shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,907 parts In-Stock

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Digiode

USA . 181 parts In-Stock

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Native Components

USA . 126 parts In-Stock

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$12.505

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Northwest PG Solutions

USA . 1,477 parts In-Stock

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$13.756

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$12.380

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SupplyDigital Components

Austria . 8,057 parts In-Stock

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Problanco Electronics

Mexico . 6,638 parts In-Stock

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TANS Electronics

Latvia . 3,893 parts In-Stock

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UHIMA Technologies

Türkiye . 752 parts In-Stock

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752

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Corphita

USA . 572 parts In-Stock

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Kulean Microsystems

USA . 324 parts In-Stock

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Corohmni

South Africa . 250 parts In-Stock

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Overview

Unlock a world of possibilities with the BF245ZL1 by Onsemi! This RF Small Signal Field Effect Transistor offers unparalleled quality and performance, backed by the trusted manufacturer Onsemi. Perfect for amplifier applications in the ultra-high frequency band, this N-channel transistor boasts a minimum DS breakdown voltage of 30V and a maximum drain current of 0.1A. Say goodbye to limitations and hello to endless opportunities with the BF245ZL1 - your key to superior amplification and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and faster switching speeds compared to P-channel FETs.

Configuration: SINGLE

Simplifies circuit design and implementation, ideal for applications requiring a single transistor.

Transistor Application: AMPLIFIER

Designed specifically for amplification purposes, ensuring optimal performance in amplifier circuits.

Minimum DS Breakdown Voltage: 30 V

Can handle higher voltages, providing a safety margin in various voltage applications.

Package Shape: ROUND

Round shape allows for easy installation and mounting in circular layouts or applications.

Terminal Form: THROUGH-HOLE

Facilitates easy soldering and connection to PCBs, ensuring secure and reliable electrical connections.

Operating Mode: DEPLETION MODE

Depletion mode FETs can operate in normally-off state, offering more control over switching behavior.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Suitable for high-frequency applications where fast response and high bandwidth are required.

No. of Terminals: 3

Simplifies circuit connections while providing necessary source, drain, and gate connections for FET operation.

Package Style (Meter): CYLINDRICAL

Cylindrical package style offers efficient use of space and easy integration in compact electronic designs.

Field Effect Transistor Technology: JUNCTION

Junction FET technology offers superior performance and reliability, suitable for various applications.

Transistor Element Material: SILICON

Silicon-based FETs provide good performance characteristics and are widely used in electronic applications.

Terminal Finish: TIN LEAD

Tin-lead terminal finish ensures good conductivity and solderability, making it easy to connect in circuits.

Maximum Drain Current (ID): 0.1 A

Capable of handling up to 0.1A of drain current, suitable for low-power applications or signal processing circuits.

Terminal Position: BOTTOM

Bottom terminal position aids in easy PCB mounting and integration, ensuring proper alignment in circuit layouts.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF245ZL1 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.1 A

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF245ZL1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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