Loading...

BF244BRL1

Onsemi

BF244BRL1 by Onsemi

BF244BRL1 by Onsemi is an N-CHANNEL RF FET with 30V DS Breakdown Voltage. Ideal for AMPLIFIER applications in ULTRA HIGH FREQUENCY BAND, it has a max ID of 0.1A and operates in DEPLETION MODE. Package: PLASTIC/EPOXY, Shape: ROUND, Terminals: 3.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,385 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,385

-

-

-

-

Vyrian

USA . 267 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

267

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 3,226 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,226

-

-

-

-

Kulean Microsystems

USA . 2,903 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,903

-

-

-

-

Corphita

USA . 2,371 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,371

-

-

-

-

Problanco Electronics

Mexico . 1,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,875

-

-

-

-

Northwest PG Solutions

USA . 1,136 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,136

-

-

-

-

Native Components

USA . 629 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

629

-

-

-

-

SupplyDigital Components

Austria . 238 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

238

-

-

-

-

Corohmni

South Africa . 165 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

165

-

-

-

-

UHIMA Technologies

Türkiye . 19 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19

-

-

-

-

Overview

Unlock the potential of your RF amplifier projects with the BF244BRL1 by Onsemi. Manufactured by a trusted industry leader, this N-CHANNEL FET offers exceptional performance in ultra high frequency applications. With its high-quality construction and reliable operation in depletion mode, this transistor provides unparalleled value for customers seeking precision and efficiency. Elevate your designs with the superior advantages of the BF244BRL1, setting new standards in RF small signal amplification.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the transistor, ensuring reliable performance in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON resistance and higher electron mobility, making them efficient for amplification applications.

Configuration: SINGLE

Single configuration simplifies circuit design and provides ease of integration into amplifier circuits.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring high performance and efficiency in amplifying signals.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltage levels without breakdown, increasing reliability.

Package Shape: ROUND

Round package shape allows for easy mounting and efficient heat dissipation, improving overall performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, making installation convenient and reliable.

Operating Mode: DEPLETION MODE

Depletion mode operation allows for easy control of the transistor's conductivity, enabling precise adjustment in amplifier circuits.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency applications, ensuring high-speed signal processing and transmission capabilities.

No. of Terminals: 3

Three terminals provide necessary connections for biasing and signal amplification, offering versatility in circuit design.

Package Style (Meter): CYLINDRICAL

Cylindrical package style provides compact and space-saving design, ideal for applications with limited space constraints.

Field Effect Transistor Technology: JUNCTION

Junction FET technology offers high input impedance and low noise operation, making it suitable for amplifier applications.

Transistor Element Material: SILICON

Silicon material provides good thermal conductivity and high reliability, ensuring stable performance in various operating conditions.

Terminal Finish: TIN LEAD

Tin lead finish on terminals offers good solderability and conductivity, ensuring reliable connections in amplifier circuits.

Maximum Drain Current (ID): 0.1 A

With a maximum drain current of 0.1A, this FET can handle moderate current levels, suitable for various amplifier applications.

Terminal Position: BOTTOM

Bottom terminal position allows for easy mounting on circuit boards and efficient heat dissipation, enhancing overall performance.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF244BRL1 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.1 A

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF244BRL1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20