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BF244BRLRE

Onsemi

BF244BRLRE by Onsemi

BF244BRLRE by Onsemi is an N-CHANNEL RF FET with 30V DS Breakdown Voltage. Ideal for AMPLIFIER applications in ULTRA HIGH FREQUENCY BAND, it features SINGLE configuration and DEPLETION MODE operation. Package: PLASTIC/EPOXY, Shape: ROUND, Terminals: 3.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,255 parts In-Stock

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Digiode

USA . 868 parts In-Stock

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TANS Electronics

Latvia . 3,730 parts In-Stock

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SupplyDigital Components

Austria . 2,722 parts In-Stock

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Kulean Microsystems

USA . 2,390 parts In-Stock

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Corphita

USA . 2,040 parts In-Stock

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Northwest PG Solutions

USA . 1,159 parts In-Stock

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Problanco Electronics

Mexico . 1,081 parts In-Stock

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Native Components

USA . 876 parts In-Stock

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UHIMA Technologies

Türkiye . 819 parts In-Stock

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Corohmni

South Africa . 149 parts In-Stock

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Overview

Unleash the power of innovation with the BF244BRLRE by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality RF Small Signal Field Effect Transistors that are designed for maximum performance and reliability. This N-CHANNEL transistor is perfect for applications like amplifiers in the ultra-high frequency band. With its superior design and construction, this product offers unmatched value, benefits, and advantages to customers who demand nothing but the best. Elevate your projects to the next level with the BF244BRLRE from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Allows for easy integration into N-channel circuits, enhancing compatibility.

Configuration: SINGLE

Simplified design makes installation and usage straightforward.

Transistor Application: AMPLIFIER

Ideal for amplifying signals, making it suitable for a wide range of electronic applications.

Minimum DS Breakdown Voltage: 30 V

Can handle higher voltages, increasing reliability in various operating conditions.

Package Shape: ROUND

Easily fits into round or cylindrical enclosures, optimizing space utilization.

Terminal Form: THROUGH-HOLE

Simplifies soldering and mounting processes during assembly.

Operating Mode: DEPLETION MODE

Offers versatility in circuit design and operation, enabling diverse applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Suitable for high-frequency signal processing, meeting the demands of advanced communication systems.

No. of Terminals: 3

Simple connection setup with only three terminals, reducing complexity in circuit design.

Package Style (Meter): CYLINDRICAL

Fits well into cylindrical packaging, making it suitable for specific electronic devices or enclosures.

Field Effect Transistor Technology: JUNCTION

Utilizes junction technology for efficient signal amplification and control.

Transistor Element Material: SILICON

Silicon-based construction offers reliability and stable performance in various operating conditions.

Terminal Finish: TIN LEAD

Enhanced solderability and conductivity for reliable electrical connections.

Maximum Drain Current (ID): 0.1 A

Suitable for low-power applications requiring limited current output.

Terminal Position: BOTTOM

Simplified circuit layout and connection management with bottom-positioned terminals.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF244BRLRE attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.1 A

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF244BRLRE Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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