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BF2030E6327

Infineon Technologies

BF2030E6327 by Infineon Technologies

BF2030E6327 by Infineon Technologies is an N-CHANNEL RF FET with 10V DS Breakdown Voltage, 20dB Power Gain, and 0.2W Power Dissipation. Ideal for AMPLIFIER applications in ULTRA HIGH FREQUENCY BAND due to DUAL GATE, DEPLETION MODE operation. Package: PLASTIC/EPOXY, Surface Mountable with GULL WING terminals.

Median Price

$0.073

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.073

1k+ parts

$0.061

10k+ parts

$0.054

3,000

-

$0.073

$0.061

$0.054

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 972 parts In-Stock

1+ parts

$0.057

100+ parts

-

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-

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972

$0.057

-

-

-

Vyrian

USA . 2,638 parts In-Stock

1+ parts

-

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2,638

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VNN

France . 1,185 parts In-Stock

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1,185

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,996 parts In-Stock

1+ parts

$0.051

100+ parts

-

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2,996

$0.051

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Corphita

USA . 783 parts In-Stock

1+ parts

$0.054

100+ parts

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783

$0.054

-

-

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Modulus Dynamics

Lithuania . 3,638 parts In-Stock

1+ parts

$0.862

100+ parts

$0.828

1k+ parts

$0.793

10k+ parts

-

3,638

$0.862

$0.828

$0.793

-

Aztec Data Supply Inc.

USA . 3,138 parts In-Stock

1+ parts

$1.010

100+ parts

-

1k+ parts

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3,138

$1.010

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A-Z Elektronik GmbH

Germany . 10,800 parts In-Stock

1+ parts

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10,800

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Argo Parts USA

USA . 3,298 parts In-Stock

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Continental Prestige Electronics

USA . 2,003 parts In-Stock

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2,003

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Alle Elektronik GmbH

Germany . 1,200 parts In-Stock

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1,200

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Robosynatics

Brazil . 250 parts In-Stock

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250

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Overview

Unlock the power of superior RF signal amplification with the BF2030E6327 by Infineon Technologies. Crafted with precision and expertise, this N-CHANNEL FET offers unparalleled performance in the ultra-high frequency band. Ideal for amplifier applications, this transistor boasts a high power gain of 20 dB, ensuring optimal signal strength for your project. With a compact and durable package shape, the BF2030E6327 delivers reliability and efficiency, making it the perfect choice for your next design. Elevate your RF projects with the quality and innovation of Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides good mechanical protection and insulation for the transistor, ensuring longevity and durability.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance characteristics and lower on-resistance compared to P-channel transistors, making this FET a good choice for amplifier applications.

Minimum DS Breakdown Voltage: 10 V

The minimum breakdown voltage of 10V ensures that the transistor can handle higher voltage levels without getting damaged, making it suitable for amplifier applications where higher voltages might be present.

Maximum Power Dissipation (Abs): 0.2 W

With a maximum power dissipation rating of 0.2W, this FET can handle moderate power levels without overheating, making it reliable in amplifier circuits.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows the transistor to operate reliably in high-temperature environments, ensuring stable performance in various conditions.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF2030E6327 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

10 V

Maximum Drain Current (Abs) (ID):

.04 A

Maximum Drain Current (ID):

.04 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Minimum Power Gain (Gp):

20 dB

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF2030E6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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