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BF2030

Infineon Technologies

BF2030 by Infineon Technologies

BF2030 by Infineon Technologies is an N-CHANNEL RF FET for AMPLIFIER applications. It operates in DUAL GATE, DEPLETION MODE with a Power Gain of 20 dB and Breakdown Voltage of 10 V. This ULTRA HIGH FREQUENCY transistor has a max Drain Current of 0.04 A and can withstand temperatures up to 150°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

VNN

France . 3,061 parts In-Stock

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3,061

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Vyrian

USA . 540 parts In-Stock

1+ parts

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540

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

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15

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Prism Electronics

USA . 10 parts In-Stock

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10

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Digiode

USA . 5 parts In-Stock

1+ parts

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 481 parts In-Stock

1+ parts

$0.317

100+ parts

-

1k+ parts

-

10k+ parts

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481

$0.317

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Aztec Data Supply Inc.

USA . 310 parts In-Stock

1+ parts

$0.900

100+ parts

-

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310

$0.900

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Modulus Dynamics

Lithuania . 22,653 parts In-Stock

1+ parts

$1.929

100+ parts

$1.852

1k+ parts

$1.775

10k+ parts

-

22,653

$1.929

$1.852

$1.775

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AZTECH Wire

Italy . 540 parts In-Stock

1+ parts

$8.305

100+ parts

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540

$8.305

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Ampacity Inc.

Singapore . 1,360 parts In-Stock

1+ parts

$19.050

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1,360

$19.050

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Kepictronics

USA . 33,000 parts In-Stock

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33,000

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A-Z Elektronik GmbH

Germany . 11,700 parts In-Stock

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11,700

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Assy Fe

Spain . 6,000 parts In-Stock

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6,000

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Argo Parts USA

USA . 4,316 parts In-Stock

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4,316

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Alle Elektronik GmbH

Germany . 1,800 parts In-Stock

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1,800

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Continental Prestige Electronics

USA . 1,790 parts In-Stock

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1,790

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Bastille Electronics

Australia . 900 parts In-Stock

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900

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Corphita

USA . 635 parts In-Stock

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635

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Overview

Experience unparalleled performance and reliability with the BF2030 by Infineon Technologies. As a leading manufacturer in the industry, Infineon’s RF Small Signal Field Effect Transistor (FET) offers top-notch quality and precision engineering. Ideal for amplifier applications, this N-CHANNEL transistor delivers a power gain of 20 dB with a minimum DS breakdown voltage of 10 V. With its dual gate, depletion mode operation and ultra high frequency band capabilities, the BF2030 ensures optimal performance in any scenario. Trust in the value and benefits that this product brings to your projects, providing you with the competitive edge you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the transistor, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and faster switching speeds compared to P-channel transistors, making this FET a good choice for high-performance applications.

Configuration: SINGLE

The single configuration simplifies the design and circuit layout, making it easier to integrate into electronic systems.

Transistor Application: AMPLIFIER

Designed for amplifier applications, this FET provides high power gain (Gp) of 20 dB, making it ideal for signal amplification.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving space and making it suitable for compact electronic devices.

Minimum DS Breakdown Voltage: 10 V

The minimum DS breakdown voltage of 10 V ensures reliable operation and protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular package shape provides compatibility with standard PCB layouts and facilitates efficient heat dissipation.

Terminal Form: GULL WING

Gull-wing terminals offer secure and reliable solder connections, ensuring stable electrical contact and long-term performance.

Operating Mode: DUAL GATE, DEPLETION MODE

Dual gate operation in depletion mode allows for precise control over the transistor's conductivity, enabling versatile circuit design options.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency applications, this FET can handle high-speed signal processing and communication systems.

Maximum Drain Current (Abs) (ID): 0.04 A

With a maximum drain current of 0.04 A, this FET can handle moderate power levels, suitable for various small signal applications.

No. of Terminals: 4

The 4-terminal configuration provides flexibility in circuit connection and layout, allowing for versatile design options.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for higher component density on the PCB, ideal for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers stable and reliable transistor performance, ensuring consistent operation over a wide temperature range.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can withstand high-temperature environments, making it suitable for a range of applications.

Transistor Element Material: SILICON

Silicon transistor elements provide high performance and reliability, making this FET a durable and long-lasting choice for electronic circuits.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good solderability and corrosion resistance, enhancing the overall reliability and longevity of the transistor.

Terminal Position: DUAL

Dual terminal position offers greater flexibility in circuit layout and connection, allowing for efficient integration into complex electronic systems.

Case Connection: SOURCE

The source case connection simplifies circuit design and facilitates stable grounding, ensuring proper operation and signal integrity.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF2030 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

10 V

Maximum Drain Current (Abs) (ID):

.04 A

Maximum Drain Current (ID):

.04 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Minimum Power Gain (Gp):

20 dB

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF2030 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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