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BF904-TAPE-7

NXP Semiconductors

BF904-TAPE-7 by NXP Semiconductors

BF904-TAPE-7 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a 7V min DS breakdown voltage, operates in the ultra-high frequency band, and has a max temp of 150 °C. Its compact surface mount design ensures efficient performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 3,632 parts In-Stock

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3,632

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Vyrian

USA . 3,360 parts In-Stock

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3,360

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Anansix

USA . 72 parts In-Stock

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72

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One Stop Electronics

USA . 1,027 parts In-Stock

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$12.050

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$12.050

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Native Components

USA . 934 parts In-Stock

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$71.000

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$68.160

934

$71.000

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$68.160

Northwest PG Solutions

USA . 438 parts In-Stock

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$78.100

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438

$78.100

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Corphita

USA . 4,132 parts In-Stock

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UNI Independent Distributors

Spain . 3,226 parts In-Stock

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Overview

Unlock unparalleled performance with the BF904-TAPE-7 from NXP Semiconductors! Renowned for its exceptional quality, this RF Small Signal FET is designed to elevate your amplification applications. Its innovative dual-gate structure ensures optimal signal handling, while the compact footprint makes it perfect for space-constrained designs. Experience reliability and efficiency that only a leader like NXP can deliver—empower your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to various environmental factors, making it suitable for diverse applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher efficiency and better performance in switching applications, making this product a reliable choice for amplifying signals.

Configuration: SINGLE WITH BUILT-IN DIODE

A single transistor with a built-in diode allows for better circuit integration and provides protection against reverse currents.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET excels in audio and RF applications, ensuring high fidelity signal reproduction.

Surface Mount: YES

Surface mount technology allows for compact designs and high-density circuit layouts, making it ideal for modern electronics.

Minimum DS Breakdown Voltage: 7 V

A minimum breakdown voltage of 7 V enables operation under various conditions while preventing damage from overvoltage situations.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB, facilitating easier integration into tightly packed circuit designs.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and ease of assembly, contributing to the overall robustness of the circuit.

Operating Mode: DUAL GATE, ENHANCEMENT MODE

Dual gate capability offers enhanced control of the device, making it flexible for various RF applications and improving overall performance.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

The capability to operate in ultra-high frequency bands makes this FET suitable for advanced communication systems and high-speed applications.

No. of Terminals: 4

With 4 terminals, this device can provide versatile connection options for optimal circuit functionality and design flexibility.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for space-saving designs and enhances fit in compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures low power consumption and high switching speeds, making this FET a great choice for energy-efficient applications.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures extends the applicability of this FET in demanding environments, ensuring reliability.

Transistor Element Material: SILICON

Silicon as the base material offers excellent electrical properties and thermal stability, ensuring reliable performance.

Maximum Drain Current (ID): 0.03 A

With a maximum drain current of 0.03 A, this transistor is well-suited for low to medium power applications, ensuring effective signal processing.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in circuit design and allows for improved thermal management and layout efficiency.

Case Connection: SOURCE

Source case connection simplifies circuit design and reduces layout complexity, leading to improved reliability in performance.

Maximum Feedback Capacitance (Crss): 0.035 pF

Low feedback capacitance ensures minimal signal distortion during amplification, which is crucial for maintaining signal integrity in high-frequency applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF904-TAPE-7 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

7 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.035 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF904-TAPE-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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