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2N4416

Texas Instruments

2N4416 by Texas Instruments

2N4416 by Texas Instruments is an N-CHANNEL FET with 30V DS Breakdown Voltage and 10dB Power Gain. Ideal for AMPLIFIER applications in VERY HIGH FREQUENCY BAND, it features DEPLETION MODE operation and 0.3W Max Power Dissipation.

Median Price

$24.670

Lifecycle Status

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49

In-Stock Inventory

1k+

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Mouser Electronics

USA . 74 parts In-Stock

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$24.670

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$17.830

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Freelance Electronics

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Nova Conductors

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Digiode

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American Microsemiconductor Inc.

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Forefront Electronics and Design

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NAC Semi

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Right Parts Inc.

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Inland Empire Components Inc.

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J & M Industries LLC

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LittleDiode

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First Choice Components Inc.

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Manoshevitz Elec. Sales

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ChromeModa Solutions

Germany . 2,026 parts In-Stock

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$0.315

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$0.258

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Aztec Data Supply Inc.

USA . 1,050 parts In-Stock

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$0.817

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$0.817

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IDEA Electronic Components Group

UK . 2,582 parts In-Stock

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$1.642

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$1.478

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DigiPath Technology Company

USA . 2,287 parts In-Stock

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$3.088

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MKK Technologies

India . 1,997 parts In-Stock

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$3.088

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Corohmni

South Africa . 149 parts In-Stock

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$6.030

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Continental Prestige Electronics

USA . 5,970 parts In-Stock

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$6.860

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$6.723

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Netroflash

USA . 100 parts In-Stock

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$6.860

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$6.860

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Semicontronic

India . 62 parts In-Stock

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$9.430

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$9.194

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$9.147

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Corphita

USA . 12,596 parts In-Stock

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$9.972

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AZTECH Wire

Italy . 620 parts In-Stock

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UNI Independent Distributors

Spain . 7,125 parts In-Stock

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Argo Parts USA

USA . 4,672 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,890 parts In-Stock

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RGB Technical Solutions

Ukraine . 3,738 parts In-Stock

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Assy Fe

Spain . 3,339 parts In-Stock

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Supply Digital

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Metaverse IC Inc.

Canada . 2,150 parts In-Stock

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Glotronic Ltd.

UK . 1,970 parts In-Stock

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RTC Component Inc.

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Authorized Procurement Solutions

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Parana Technologies

USA . 1,113 parts In-Stock

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Perfect Parts

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Kepictronics

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Cyclops Electronics Ltd (Excess)

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments 2N4416 RF Small Signal Field Effect Transistor. Manufactured by a leader in the industry, this N-CHANNEL transistor offers unparalleled quality and reliability for your amplifier applications. With a very high frequency band and a minimal power gain of 10 dB, this single configuration transistor delivers exceptional performance. Trust Texas Instruments to provide you with the value and benefits you need to take your projects to the next level. Experience the difference today!

Feature Benefit Bullets

Package Body Material: METAL

The use of metal package body material enhances durability and provides better heat dissipation, allowing for reliable operation in various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their higher mobility of charge carriers, resulting in better performance and efficiency in amplifier applications.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltage levels without breakdown, ensuring stable operation in amplifier circuits.

Maximum Power Dissipation (Abs): 0.3 W

With a maximum power dissipation of 0.3W, this FET can handle moderate power levels without overheating, making it suitable for amplifier applications.

Maximum Operating Temperature: 200 °C

The high maximum operating temperature of 200°C allows this FET to withstand elevated temperatures, improving reliability in amplifier circuits.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) 2N4416 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Texas Instruments

Specs

Case Connection:

ISOLATED

Configuration:

Minimum DS Breakdown Voltage:

30 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

.8 pF

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-72

JESD-30 Code:

O-MBCY-W4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Minimum Power Gain (Gp):

10 dB

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Form:

WIRE

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

2N4416 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-00-222-1375, 5961002221375, 5961-00-469-9905, 5961004699905, 5961-01-040-7357, 5961010407357, 5961-00-481-6252, 5961004816252, 5961-00-501-1100, 5961005011100, 5961-00-107-2678, 5961001072678, 5961-00-137-4066, 5961001374066, 5961-00-117-3793, 5961001173793, 5961-01-048-5634, 5961010485634, 5961-01-011-4957, 5961010114957, 5961-99-118-3067, 5961991183067, 5961-99-599-0106, 5961995990106

NIIN

002221375, 004699905, 010407357, 004816252, 005011100, 001072678, 001374066, 001173793, 010485634, 010114957, 991183067, 995990106

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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