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BF909R-TAPE-7

NXP Semiconductors

BF909R-TAPE-7 by NXP Semiconductors

BF909R-TAPE-7 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a max DS breakdown voltage of 7V, operates in the ultra-high frequency band, and supports dual gate enhancement mode. Ideal for compact surface mount designs, it ensures reliable performance up to 150 °C.

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3

In-Stock Inventory

1k+

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Digiode

USA . 3,313 parts In-Stock

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Anansix

USA . 2,617 parts In-Stock

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Vyrian

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One Stop Electronics

USA . 446 parts In-Stock

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Corphita

USA . 4,607 parts In-Stock

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UNI Independent Distributors

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Northwest PG Solutions

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Native Components

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Overview

Elevate your RF applications with the BF909R-TAPE-7 from NXP Semiconductors, a trusted leader in high-quality electronic components. This N-channel FET delivers reliable performance in ultra-high frequency ranges, making it ideal for amplifiers in cutting-edge technologies. With its compact design and built-in diode, you'll enjoy seamless integration, enhanced efficiency, and exceptional thermal stability. Choose NXP for superior innovation and ensure your projects thrive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and protection against environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower on-resistance and better performance in high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances design simplicity and provides protection against voltage spikes.

Transistor Application: AMPLIFIER

Designed for amplifier applications, this FET delivers excellent linearity and gain characteristics.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into automated assembly processes.

Minimum DS Breakdown Voltage: 7 V

With a minimum breakdown voltage of 7 V, this FET can operate safely in low-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on printed circuit boards (PCBs) and aids in thermal management.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and improve soldering reliability.

Operating Mode: DUAL GATE, ENHANCEMENT MODE

The dual gate and enhancement mode operation increase versatility, allowing for improved control over the transistor's performance.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating in the ultra-high frequency band makes this FET ideal for high-frequency applications such as RF amplifiers.

No. of Terminals: 4

A four-terminal design facilitates easier integration into circuits while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves board space, making it beneficial for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for low power consumption and high-speed operation, which are critical for modern applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures high reliability and stability under extreme conditions.

Transistor Element Material: SILICON

Silicon as the element material provides excellent electrical properties for high performance in various applications.

Maximum Drain Current (ID): 0.04 A

The maximum drain current rating of 0.04 A is suitable for small-signal applications, ensuring efficient power handling.

Terminal Position: DUAL

Dual terminal positioning enhances connectivity options, improving installation flexibility within circuit designs.

Case Connection: SOURCE

Having the source as the case connection minimizes parasitic effects, stabilizing the device's performance.

Maximum Feedback Capacitance (Crss): 0.05 pF

Low feedback capacitance ensures high speed and reduced distortion in amplification applications, making it ideal for RF use.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF909R-TAPE-7 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

7 V

Maximum Drain Current (ID):

.04 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.05 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF909R-TAPE-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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