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BF256A

Onsemi

BF256A by Onsemi

N-CHANNEL; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): .3 W; Terminal Form: THROUGH-HOLE; No. of Terminals: 3;

Median Price

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Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

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Vyrian

USA . 7,926 parts In-Stock

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Digiode

USA . 7,316 parts In-Stock

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Anansix

USA . 4,781 parts In-Stock

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PC Components Company LLC

USA . 615 parts In-Stock

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Bristol Electronics

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Resion

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ACDS - Activité Composants Distribution Service

France . 300 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 110 parts In-Stock

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Ashlea Components Ltd

UK . 86 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 80 parts In-Stock

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Holdelec - ElecDif-Pro

France . 80 parts In-Stock

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Manotoh

Italy . 63 parts In-Stock

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LittleDiode

UK . 47 parts In-Stock

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Huijzer Components

Netherlands . 45 parts In-Stock

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Pegasus Components GmbH

Germany . 7 parts In-Stock

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ECAB

Sweden . 3 parts In-Stock

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GES GmbH

Germany . 2 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 449 parts In-Stock

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$0.050

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Native Components

USA . 2,444 parts In-Stock

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$0.071

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$0.068

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Northwest PG Solutions

USA . 5,403 parts In-Stock

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$0.078

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$0.069

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$0.078

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$0.069

Modulus Dynamics

Lithuania . 15,922 parts In-Stock

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$0.395

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$0.379

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$0.363

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Parana Technologies

USA . 227 parts In-Stock

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$0.535

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$1.644

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DigiPath Technology Company

USA . 153 parts In-Stock

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$0.589

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$0.542

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ChromeModa Solutions

Germany . 6,660 parts In-Stock

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IDEA Electronic Components Group

UK . 2,125 parts In-Stock

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AZTECH Wire

Italy . 415 parts In-Stock

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One Stop Electronics

USA . 1,741 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,013 parts In-Stock

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Kulean Microsystems

USA . 7,636 parts In-Stock

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SupplyDigital Components

Austria . 7,462 parts In-Stock

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Corphita

USA . 5,752 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,712 parts In-Stock

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TANS Electronics

Latvia . 5,545 parts In-Stock

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Problanco Electronics

Mexico . 5,444 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,808 parts In-Stock

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Assy Fe

Spain . 2,710 parts In-Stock

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Metaverse IC Inc.

Canada . 2,490 parts In-Stock

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UNI Independent Distributors

Spain . 2,226 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Supply Digital

USA . 1,608 parts In-Stock

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UHIMA Technologies

Türkiye . 704 parts In-Stock

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Corohmni

South Africa . 447 parts In-Stock

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Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF256A attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

30 V

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Element Material:

SILICON

Trade Compliance

BF256A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-15-167-4397, 5961151674397, 5961-22-284-4102, 5961222844102, 5961-01-357-1124, 5961013571124, 5961-14-371-3320, 5961143713320

NIIN

151674397, 222844102, 013571124, 143713320

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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