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BF256ARLRA

Onsemi

BF256ARLRA by Onsemi

BF256ARLRA by Onsemi is an N-CHANNEL RF FET with 30V DS Breakdown Voltage. Operating in DEPLETION MODE, it offers ULTRA HIGH FREQUENCY performance. Ideal for applications requiring high frequency amplification in a CYLINDRICAL package with THROUGH-HOLE terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,216 parts In-Stock

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Vyrian

USA . 1,444 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 311 parts In-Stock

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$0.151

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$0.145

311

$0.151

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$0.145

Northwest PG Solutions

USA . 934 parts In-Stock

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$0.166

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$0.146

934

$0.166

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$0.146

Problanco Electronics

Mexico . 7,856 parts In-Stock

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Kulean Microsystems

USA . 5,398 parts In-Stock

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5,398

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TANS Electronics

Latvia . 1,872 parts In-Stock

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Corphita

USA . 1,152 parts In-Stock

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SupplyDigital Components

Austria . 751 parts In-Stock

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751

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UHIMA Technologies

Türkiye . 386 parts In-Stock

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Corohmni

South Africa . 253 parts In-Stock

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Overview

Unleash the power of ultra-high frequency band applications with the BF256ARLRA by Onsemi. Crafted by a leading manufacturer in RF small signal field effect transistors, this N-channel transistor offers unparalleled quality and reliability. Perfect for depletion mode operation, this single configuration transistor boasts a minimum DS breakdown voltage of 30V. Whether you're designing cutting-edge electronics or optimizing existing systems, the BF256ARLRA delivers exceptional performance and value. Upgrade your projects today with this high-quality, high-frequency transistor from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and reliability of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for their high input impedance and low output impedance, making them suitable for many applications.

Configuration: SINGLE

Single configuration simplifies the design process and reduces the complexity of the circuit where the transistor is used.

Minimum DS Breakdown Voltage: 30 V

The high breakdown voltage of 30V makes this transistor suitable for applications where higher voltage handling is required.

Package Shape: ROUND

The round package shape allows for easy integration and mounting in various electronic circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection to the circuit board, ensuring proper functionality.

Operating Mode: DEPLETION MODE

Depletion mode operation offers flexibility in controlling the transistor's conductance and enhances its performance in certain applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

The ultra high frequency band capability allows for high-speed signal processing and communication applications.

No. of Terminals: 3

Having 3 terminals provides the necessary connections for input, output, and biasing, enabling versatile use in various circuit configurations.

Package Style (Meter): CYLINDRICAL

The cylindrical package style offers a compact and space-saving design for applications where board space is limited.

Field Effect Transistor Technology: JUNCTION

Junction FET technology ensures high performance and reliability in signal amplification and switching applications.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its thermal stability and performance, making it ideal for the transistor's element.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good solderability, ensuring easy and reliable connections during assembly.

Terminal Position: BOTTOM

The bottom terminal position simplifies the mounting and soldering process, enhancing the ease of integration of the transistor in circuits.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF256ARLRA attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

30 V

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Element Material:

SILICON

Trade Compliance

BF256ARLRA Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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