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BF256AZL1

Onsemi

BF256AZL1 by Onsemi

BF256AZL1 by Onsemi is an N-CHANNEL RF FET with 30V DS Breakdown Voltage. Operating in DEPLETION MODE, it offers ULTRA HIGH FREQUENCY performance. Ideal for applications requiring JUNCTION technology in a CYLINDRICAL package with THROUGH-HOLE terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,509 parts In-Stock

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1,509

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Vyrian

USA . 1,125 parts In-Stock

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1,125

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Distributors (Availability)

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Native Components

USA . 475 parts In-Stock

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$0.151

100+ parts

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$0.145

475

$0.151

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$0.145

Northwest PG Solutions

USA . 1,012 parts In-Stock

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$0.166

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$0.146

1,012

$0.166

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$0.146

Problanco Electronics

Mexico . 5,095 parts In-Stock

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5,095

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SupplyDigital Components

Austria . 2,279 parts In-Stock

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2,279

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TANS Electronics

Latvia . 1,887 parts In-Stock

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1,887

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Corphita

USA . 1,512 parts In-Stock

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Kulean Microsystems

USA . 377 parts In-Stock

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377

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Corohmni

South Africa . 122 parts In-Stock

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UHIMA Technologies

Türkiye . 4 parts In-Stock

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Overview

Enhance your RF signal processing with the BF256AZL1 by Onsemi. Known for their high-quality manufacturing, Onsemi brings you a reliable N-CHANNEL field effect transistor that excels in ultra-high frequency applications. Perfect for amplification and switching tasks, this single-configured transistor offers superior performance and durability. Say goodbye to signal interference and hello to seamless communication with the BF256AZL1. Elevate your projects with this top-notch component today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have better performance characteristics compared to P-Channel transistors, making this product a good choice for high-speed and high-frequency applications.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this transistor can handle higher voltages without getting damaged, ensuring reliable performance in different voltage scenarios.

Package Shape: ROUND

The round package shape allows for easy mounting and installation, making it convenient for use in various electronic circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, making this transistor suitable for applications where reliability and durability are crucial.

Operating Mode: DEPLETION MODE

Depletion mode operation allows for easy control of the transistor's conductance, making it ideal for applications that require precise voltage regulation.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

The ability to operate in the ultra-high-frequency band makes this transistor perfect for applications that require fast signal processing and high-frequency operation.

No. of Terminals: 3

Having 3 terminals allows for versatile connections and compatibility with different circuit designs, increasing the flexibility of this transistor in various applications.

Package Style (Meter): CYLINDRICAL

The cylindrical package style is space-efficient and easy to handle, making this transistor suitable for compact electronic devices and tight circuit layouts.

Field Effect Transistor Technology: JUNCTION

Junction field-effect transistor technology offers high input impedance and low output impedance, providing excellent signal amplification and switching capabilities for different applications.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its reliability and performance, making this transistor ideal for demanding applications that require stable and consistent operation.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides good solderability and conductivity, ensuring secure connections and reliable performance in various operating conditions.

Terminal Position: BOTTOM

Having terminals positioned at the bottom of the package makes it easier to mount and solder, enhancing the usability and convenience of this transistor for circuit integration.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF256AZL1 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Configuration:

Minimum DS Breakdown Voltage:

30 V

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Element Material:

SILICON

Trade Compliance

BF256AZL1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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