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J310RLRE

Onsemi

J310RLRE by Onsemi

J310RLRE by Onsemi is an N-CHANNEL RF FET with a 25V DS Breakdown Voltage, ideal for AMPLIFIER applications. Operating in DEPLETION MODE, it offers ULTRA HIGH FREQUENCY performance with a Max Operating Temperature of 125 °C. This THROUGH-HOLE transistor features a PLASTIC/EPOXY body and has 3 terminals in a CYLINDRICAL package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,080 parts In-Stock

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2,080

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Vyrian

USA . 2,023 parts In-Stock

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2,023

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SupplyDigital Components

Austria . 7,775 parts In-Stock

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7,775

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TANS Electronics

Latvia . 5,329 parts In-Stock

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5,329

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Problanco Electronics

Mexico . 4,330 parts In-Stock

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Kulean Microsystems

USA . 3,668 parts In-Stock

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3,668

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Corphita

USA . 1,985 parts In-Stock

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1,985

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UHIMA Technologies

Türkiye . 693 parts In-Stock

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693

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Corohmni

South Africa . 351 parts In-Stock

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Overview

Enhance your electronic projects with the J310RLRE RF Small Signal Field Effect Transistor by Onsemi. Manufactured with precision and expertise, this N-CHANNEL transistor is designed for high-performance applications such as amplifiers in the ultra-high-frequency band. Its durable plastic/epoxy package ensures reliability while its depletion mode operation allows for efficient power management. Trust Onsemi to deliver a superior product that offers exceptional value, benefits, and advantages to customers looking for quality components for their projects. Experience the difference with the J310RLRE today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides good insulation and protection for the transistor, making it durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have higher electron mobility and lower resistance compared to P-Channel FETs, making them more efficient for amplification applications.

Configuration: SINGLE

Single configuration FETs are simpler to use and provide straightforward amplification capabilities without the complexity of multiple channels.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this FET ensures optimal performance and high-quality signal amplification.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this FET can handle higher voltages without experiencing failure, ensuring reliable operation.

Package Shape: ROUND

The round package shape allows for easy mounting and installation in various electronic devices, making it versatile and convenient to work with.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and are commonly used in applications where stability and reliability are crucial.

Operating Mode: DEPLETION MODE

Depletion mode FETs offer simplicity in circuit design and can easily be turned on or off, making them ideal for amplifier applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating in the ultra-high frequency band, this FET is capable of handling high-frequency signals with precision and efficiency.

No. of Terminals: 3

With three terminals, this FET allows for easy control and manipulation of signals, enabling versatile use in various electronic circuits.

Package Style (Meter): CYLINDRICAL

The cylindrical package style provides compact and space-saving integration options, making it suitable for applications with limited space.

Field Effect Transistor Technology: JUNCTION

Junction FET technology offers high-speed switching capabilities and low noise performance, ensuring optimal signal amplification.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this FET can withstand high temperatures without compromising its performance, ensuring long-term reliability.

Transistor Element Material: SILICON

Silicon FETs offer excellent thermal stability, high breakdown voltage, and low leakage current, making them ideal for amplifier applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides reliable solder connections and ensures strong electrical contact, improving overall performance and durability.

Terminal Position: BOTTOM

Bottom terminal position offers easy accessibility for connections and allows for efficient PCB layout, enhancing the overall usability of the FET.

Maximum Feedback Capacitance (Crss): 2.5 pF

With a low maximum feedback capacitance, this FET minimizes signal distortion and improves overall signal integrity, making it suitable for high-frequency applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) J310RLRE attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

2.5 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

125 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

J310RLRE Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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