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BF245BRL

Onsemi

BF245BRL by Onsemi

BF245BRL by Onsemi is an N-CHANNEL FET with 30V DS Breakdown Voltage. It operates in DEPLETION MODE for AMPLIFIER applications at ULTRA HIGH FREQUENCY BAND. This SINGLE configuration transistor has a max ID of 0.1A and comes in a CYLINDRICAL package with TIN LEAD finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,042 parts In-Stock

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Vyrian

USA . 1,815 parts In-Stock

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Native Components

USA . 402 parts In-Stock

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$38.503

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$36.963

402

$38.503

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$36.963

Northwest PG Solutions

USA . 1,755 parts In-Stock

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$42.353

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TANS Electronics

Latvia . 6,425 parts In-Stock

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Problanco Electronics

Mexico . 4,415 parts In-Stock

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SupplyDigital Components

Austria . 4,412 parts In-Stock

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Corphita

USA . 1,060 parts In-Stock

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Kulean Microsystems

USA . 805 parts In-Stock

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805

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UHIMA Technologies

Türkiye . 452 parts In-Stock

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Corohmni

South Africa . 178 parts In-Stock

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Overview

Unlock the power of high-quality RF signal amplification with the Onsemi BF245BRL. Manufactured by Onsemi, a trusted name in semiconductor technology, this N-CHANNEL FET offers superior performance in a variety of applications. Whether you're looking to enhance your amplifier circuits or boost signal strength in ultra high-frequency bands, this transistor delivers exceptional value and reliability. Experience the benefits of precision engineering and cutting-edge technology with the BF245BRL from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the transistor, ensuring long-lasting performance.

Polarity or Channel Type: N-CHANNEL

N-channel transistors have higher electron mobility, making them more efficient for use in amplifier applications.

Configuration: SINGLE

Single configuration simplifies circuit design and integration, making it easy to use in amplifier applications.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance and efficiency in signal amplification.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this transistor can handle higher voltage fluctuations without damage, ensuring reliability.

Package Shape: ROUND

Round package shape allows for easy mounting and installation in various electronic devices, providing versatility in usage.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, ensuring stable electrical connections.

Operating Mode: DEPLETION MODE

Depletion mode operation allows for easy biasing and control in amplifier circuits, making it a suitable choice for amplifier applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency applications, ensuring optimal performance in high-speed signal amplification.

No. of Terminals: 3

Three terminals provide necessary connections for proper operation and functionality in amplifier circuits.

Package Style (Meter): CYLINDRICAL

Cylindrical package style offers compact size and easy integration into electronic devices, making it a space-efficient choice for amplifier applications.

Field Effect Transistor Technology: JUNCTION

Junction FET technology provides high gain and low noise, making it an ideal choice for amplifier applications.

Transistor Element Material: SILICON

Silicon material ensures high performance and reliability in signal amplification, making it a durable choice for amplifier circuits.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers good solderability and corrosion resistance, ensuring stable connections for optimal performance.

Maximum Drain Current (ID): 0.1 A

With a maximum drain current of 0.1A, this transistor can handle moderate current loads in amplifier circuits, ensuring reliable operation.

Terminal Position: BOTTOM

Bottom terminal position allows for easy mounting and soldering, providing convenience in circuit assembly and integration.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF245BRL attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.1 A

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF245BRL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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