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BF246A

NXP Semiconductors

BF246A by NXP Semiconductors

N-CHANNEL; Configuration: SINGLE; Surface Mount: NO; Field Effect Transistor Technology: JUNCTION; Package Shape: ROUND; Maximum Operating Temperature: 150 Cel;

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 11,381 parts In-Stock

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Vyrian

USA . 7,068 parts In-Stock

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Anansix

USA . 3,324 parts In-Stock

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3,324

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ComSIT Distribution GmbH

Germany . 700 parts In-Stock

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700

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ECAB

Sweden . 113 parts In-Stock

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113

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GES GmbH

Germany . 90 parts In-Stock

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90

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Jameco Electronics

USA . 36 parts In-Stock

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36

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Fibra_Brandt Electronic GMBH

Germany . 23 parts In-Stock

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Pegasus Components GmbH

Germany . 18 parts In-Stock

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LittleDiode

UK . 13 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,560 parts In-Stock

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$0.269

100+ parts

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$1.532

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1,560

$0.269

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$1.532

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DigiPath Technology Company

USA . 801 parts In-Stock

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$0.296

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$0.272

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801

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ChromeModa Solutions

Germany . 2,638 parts In-Stock

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$0.302

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$0.248

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$0.302

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IDEA Electronic Components Group

UK . 1,264 parts In-Stock

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$0.302

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$0.272

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$1.257

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$1.245

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$1.195

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100

$1.257

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Modulus Dynamics

Lithuania . 11,512 parts In-Stock

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$1.656

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$1.590

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$1.524

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11,512

$1.656

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$1.524

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AZTECH Wire

Italy . 474 parts In-Stock

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$18.606

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Native Components

USA . 741 parts In-Stock

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$55.210

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$53.002

741

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$53.002

Northwest PG Solutions

USA . 4,151 parts In-Stock

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$60.731

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$60.731

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One Stop Electronics

USA . 2,662 parts In-Stock

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$61.050

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QUARKTWIN TECHNOLOGY LTD

USA . 26,732 parts In-Stock

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UNI Independent Distributors

Spain . 7,103 parts In-Stock

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Corphita

USA . 5,575 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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TANS Electronics

Latvia . 3,892 parts In-Stock

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Kulean Microsystems

USA . 3,510 parts In-Stock

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SupplyDigital Components

Austria . 2,752 parts In-Stock

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Supply Digital

USA . 1,656 parts In-Stock

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Problanco Electronics

Mexico . 1,584 parts In-Stock

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UHIMA Technologies

Türkiye . 757 parts In-Stock

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Assy Fe

Spain . 358 parts In-Stock

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Corohmni

South Africa . 353 parts In-Stock

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Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF246A attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BF246A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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