Loading...

BF244ARLRA

Onsemi

BF244ARLRA by Onsemi

BF244ARLRA by Onsemi is an N-CHANNEL RF FET with 30V DS breakdown voltage. Ideal for AMPLIFIER applications in ULTRA HIGH FREQUENCY BAND, it has a max ID of 0.1A and operates in DEPLETION MODE. Package: PLASTIC/EPOXY, Shape: ROUND, Terminals: 3 (THROUGH-HOLE).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 730 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

730

-

-

-

-

Vyrian

USA . 474 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

474

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 836 parts In-Stock

1+ parts

$1.520

100+ parts

-

1k+ parts

-

10k+ parts

-

836

$1.520

-

-

-

Northwest PG Solutions

USA . 930 parts In-Stock

1+ parts

$1.672

100+ parts

-

1k+ parts

-

10k+ parts

-

930

$1.672

-

-

-

TANS Electronics

Latvia . 8,314 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,314

-

-

-

-

Kulean Microsystems

USA . 6,686 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,686

-

-

-

-

Problanco Electronics

Mexico . 5,896 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,896

-

-

-

-

SupplyDigital Components

Austria . 5,366 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,366

-

-

-

-

UHIMA Technologies

Türkiye . 898 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

898

-

-

-

-

Corphita

USA . 387 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

387

-

-

-

-

Corohmni

South Africa . 135 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

135

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the BF244ARLRA by Onsemi, a top-tier manufacturer known for delivering quality products. This RF Small Signal Field Effect Transistor (FET) boasts incredible performance in amplifier applications, operating in depletion mode within the ultra-high frequency band. With a robust package body material and N-channel configuration, this transistor offers customers reliability, efficiency, and value like no other. Upgrade your projects with the BF244ARLRA and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better electrical performance and higher efficiency compared to P-channel FETs, making them a preferred choice for many applications.

Configuration: SINGLE

Single configuration simplifies the design and makes it easier to integrate into circuits, reducing overall complexity.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance and efficiency in amplifying signals.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30 V, this FET can handle higher voltages without failure, making it suitable for a wide range of applications.

Package Shape: ROUND

Round package shape allows for easy mounting and integration into various systems, providing flexibility in design.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer a secure and stable connection, ensuring reliable performance in different environments.

Operating Mode: DEPLETION MODE

Depletion mode operation allows for simple biasing and control, making it easy to use in circuits without complex circuitry.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency applications, offering excellent performance in high-speed and high-frequency circuits.

No. of Terminals: 3

Having 3 terminals allows for easy connectivity and integration into circuits, simplifying the design process.

Package Style (Meter): CYLINDRICAL

Cylindrical package style offers compact size and efficient heat dissipation, making it suitable for space-constrained applications.

Field Effect Transistor Technology: JUNCTION

Junction FET technology provides high gain, low noise, and low distortion, ensuring high-quality performance in amplification applications.

Transistor Element Material: SILICON

Silicon as the element material offers high reliability, temperature stability, and performance, making it a preferred choice for electronic components.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity, ensuring a secure and reliable connection in circuits.

Maximum Drain Current (ID): 0.1 A

With a maximum drain current of 0.1 A, this FET can handle moderate current levels, making it suitable for various low to medium power applications.

Terminal Position: BOTTOM

Bottom terminal position offers easy accessibility for soldering and connection, simplifying the assembly process.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF244ARLRA attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.1 A

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF244ARLRA Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20