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CLF1G0035S-100PU

NXP Semiconductors

CLF1G0035S-100PU by NXP Semiconductors

The NXP Semiconductors CLF1G0035S-100PU is an RF FET with 150V DS breakdown voltage, operating in depletion mode. It features N-channel polarity, common source configuration, and gallium nitride element material. Ideal for S band applications like amplifiers due to its high electron mobility technology.

Median Price

$273.450

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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RFMW

USA . 20 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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$273.450

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750

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Vyrian

USA . 8,861 parts In-Stock

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Digiode

USA . 1,766 parts In-Stock

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Anansix

USA . 324 parts In-Stock

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$0.408

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$0.371

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$0.335

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40

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Ampacity Inc.

Singapore . 20 parts In-Stock

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$10.050

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AZTECH Wire

Italy . 252 parts In-Stock

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$15.259

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Component Stockers USA

USA . 714 parts In-Stock

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$99.990

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Continental Prestige Electronics

USA . 2,330 parts In-Stock

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$273.450

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$267.981

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Netroflash

USA . 100 parts In-Stock

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$273.450

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$267.981

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Microchip USA

USA . 7,992 parts In-Stock

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UNI Independent Distributors

Spain . 6,889 parts In-Stock

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Corphita

USA . 3,285 parts In-Stock

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Argo Parts USA

USA . 1,728 parts In-Stock

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Overview

Elevate your RF amplifier performance with the CLF1G0035S-100PU by NXP Semiconductors. Known for their superior quality and cutting-edge technology, NXP Semiconductors delivers top-of-the-line RF Small Signal FETs that are perfect for a variety of applications. Whether you need to boost signal strength or enhance your amplifier system, this product offers unmatched value, benefits, and advantages. Trust NXP Semiconductors to take your projects to new heights with the CLF1G0035S-100PU.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package body material provides durability and reliability for the transistor, ensuring it can withstand various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance characteristics compared to P-channel transistors, making this product ideal for high-frequency amplifier applications.

Configuration: COMMON SOURCE, 2 ELEMENTS

The common source configuration with 2 elements allows for efficient signal amplification and better overall performance.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor is optimized for performance in signal amplification circuits.

Minimum DS Breakdown Voltage: 150 V

The high breakdown voltage of 150V ensures the transistor can handle high voltage levels without failure, increasing its reliability in demanding applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit layouts and ensures efficient use of space on a PCB.

Field Effect Transistor Technology: HIGH ELECTRON MOBILITY

High electron mobility technology offers superior speed and performance, making this transistor ideal for high-frequency applications in the S band.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) CLF1G0035S-100PU attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

150 V

Field Effect Transistor Technology:

HIGH ELECTRON MOBILITY

Highest Frequency Band:

S BAND

JESD-30 Code:

R-CDFP-F4

No. of Elements:

2

No. of Terminals:

4

Operating Mode:

DEPLETION MODE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Polarity or Channel Type:

Reference Standard:

IEC-60134

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

GALLIUM NITRIDE

Trade Compliance

CLF1G0035S-100PU Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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