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2N5486RLRPG

Onsemi

2N5486RLRPG by Onsemi

2N5486RLRPG by Onsemi is an N-CHANNEL RF FET with a power gain of 10 dB, ideal for AMPLIFIER applications in the ULTRA HIGH FREQUENCY BAND. It has a max power dissipation of 0.31 W and operates in DEPLETION MODE at up to 150 °C, featuring a JUNCTION technology and SILICON element material.

Median Price

$1.752

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 69 parts In-Stock

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$1.752

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$1.594

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$1.437

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69

$1.752

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$1.437

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Digiode

USA . 741 parts In-Stock

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$1.664

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Chip Stock

USA . 53,000 parts In-Stock

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Vyrian

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Corphita

USA . 185 parts In-Stock

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$1.577

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Corohmni

South Africa . 477 parts In-Stock

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$1.752

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Advanced Electronics

New Zealand . 69 parts In-Stock

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$1.752

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$1.594

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$1.437

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69

$1.752

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$1.437

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Native Components

USA . 982 parts In-Stock

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$7.140

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QUARKTWIN TECHNOLOGY LTD

USA . 22,619 parts In-Stock

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Problanco Electronics

Mexico . 7,865 parts In-Stock

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Kulean Microsystems

USA . 7,226 parts In-Stock

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TANS Electronics

Latvia . 1,097 parts In-Stock

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UHIMA Technologies

Türkiye . 791 parts In-Stock

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Northwest PG Solutions

USA . 738 parts In-Stock

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SupplyDigital Components

Austria . 507 parts In-Stock

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Overview

Unlock the power of ultra-high frequency signal amplification with the Onsemi 2N5486RLRPG RF Small Signal Field Effect Transistor. Manufactured by a leader in semiconductor technology, this N-channel transistor offers superior performance and reliability for amplifier applications. With a minimum power gain of 10dB and maximum operating temperature of 150 °C, this transistor provides exceptional value and benefits to customers seeking high-quality components for their electronic projects. Upgrade your RF amplifier circuits with the Onsemi 2N5486RLRPG and experience enhanced signal processing like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for portable and compact devices.

Polarity or Channel Type: N-CHANNEL

Efficient for amplifying negative signals, suitable for specific circuit designs.

Minimum Power Gain (Gp): 10 dB

Provides significant amplification, enhancing signal strength effectively.

Package Shape: ROUND

Simplifies mounting and integration into circular designs.

Operating Mode: DEPLETION MODE

Offers low leakage current and high input impedance for better performance.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of handling high-frequency signals, suitable for advanced communication systems.

Maximum Power Dissipation (Abs): 0.31 W

Efficient power handling capability for stable operation under varying loads.

Transistor Element Material: SILICON

Reliable and widely used semiconductor material for consistent performance.

Maximum Drain Current (ID): 0.03 A

Sufficient current capacity for amplification tasks in small signal applications.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes for secure connections.

Maximum Feedback Capacitance (Crss): 1 pF

Low feedback capacitance minimizes signal distortion and improves overall performance.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) 2N5486RLRPG attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

1 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Minimum Power Gain (Gp):

10 dB

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

2N5486RLRPG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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