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BF909-TAPE-7

NXP Semiconductors

BF909-TAPE-7 by NXP Semiconductors

BF909-TAPE-7 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a max DS breakdown voltage of 7V, operates in the ultra-high frequency band, and supports dual gate enhancement mode. This compact surface mount device ensures efficient performance with a max temp of 150 °C.

Median Price

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3

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1k+

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Digiode

USA . 3,467 parts In-Stock

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Vyrian

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Anansix

USA . 398 parts In-Stock

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One Stop Electronics

USA . 558 parts In-Stock

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Northwest PG Solutions

USA . 1,035 parts In-Stock

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Native Components

USA . 565 parts In-Stock

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UNI Independent Distributors

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Corphita

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Overview

Unlock unparalleled performance with the BF909-TAPE-7 from NXP Semiconductors, a leader in innovation and quality. This exceptional RF Small Signal FET is designed for seamless amplification in ultra-high frequency applications, ensuring your projects achieve maximum efficiency and reliability. With its compact design and robust features, experience the advantages of enhanced signal integrity that propel your technology forward—perfect for cutting-edge communication systems!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body provides durability and is lightweight, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and are widely used in digital and analog circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode improves circuit protection and simplifies board design by reducing component count.

Transistor Application: AMPLIFIER

Designed for amplification, this transistor is ideal for audio and radio frequency applications.

Surface Mount: YES

Surface mount technology allows for compact circuit designs and is easier to automate in the manufacturing process.

Minimum DS Breakdown Voltage: 7 V

With a 7V minimum breakdown voltage, this FET is well-suited for low-voltage applications.

Package Shape: RECTANGULAR

Rectangular package shape aids in efficient space utilization and better alignment on PCB.

Terminal Form: GULL WING

Gull wing leads facilitate easier soldering and are ideal for automated PCB assembly.

Operating Mode: DUAL GATE, ENHANCEMENT MODE

The dual gate feature allows for better control of signal amplification, enhancing overall performance.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

This transistor's capability to operate in the ultra-high frequency band makes it suitable for RF applications.

No. of Terminals: 4

Having 4 terminals simplifies circuit design and allows for efficient usage in compact spaces.

Package Style (Meter): SMALL OUTLINE

The small outline package style is advantageous for space-constrained designs and provides better thermal performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, which enhances battery life in portable devices.

Maximum Operating Temperature: 150 °C

Operating at up to 150 °C allows this FET to function reliably in high-temperature environments.

Transistor Element Material: SILICON

Silicon is a well-established material for FETs providing excellent electrical properties and reliability.

Maximum Drain Current (ID): 0.04 A

A maximum drain current of 0.04 A indicates capability for moderate power applications while maintaining efficiency.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in circuit design and connections.

Case Connection: SOURCE

Source connection helps stabilize the operation of the transistor, contributing to better performance in analog applications.

Maximum Feedback Capacitance (Crss): 0.05 pF

Low feedback capacitance is essential for high-frequency performance, reducing signal distortion in RF applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF909-TAPE-7 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

7 V

Maximum Drain Current (ID):

.04 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.05 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF909-TAPE-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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