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BF904R-TAPE-13

NXP Semiconductors

BF904R-TAPE-13 by NXP Semiconductors

BF904R-TAPE-13 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a max DS breakdown voltage of 7V, operates in the ultra-high frequency band, and supports dual gate enhancement mode. This compact surface mount device excels in high-frequency circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,583 parts In-Stock

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Digiode

USA . 4,266 parts In-Stock

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4,266

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Anansix

USA . 702 parts In-Stock

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702

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Native Components

USA . 525 parts In-Stock

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$0.221

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$0.212

525

$0.221

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Northwest PG Solutions

USA . 2,046 parts In-Stock

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$0.243

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$0.214

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$0.243

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One Stop Electronics

USA . 1,010 parts In-Stock

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$62.050

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1,010

$62.050

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UNI Independent Distributors

Spain . 2,757 parts In-Stock

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Corphita

USA . 934 parts In-Stock

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934

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Overview

Elevate your RF design with the BF904R-TAPE-13 from NXP Semiconductors, a trusted leader in innovation. This high-quality N-channel FET is engineered for exceptional performance in ultra-high frequency applications, ensuring reliability and efficiency in amplifying signals. With its compact surface mount design and built-in diode, it simplifies integration while providing superior thermal management. Experience unmatched value and precision for your projects, backed by NXP's legacy of excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and protection, making this FET suitable for various applications where reliability is key.

Polarity or Channel Type: N-CHANNEL

As an N-channel FET, it provides better performance and efficiency in amplifying signals, making it ideal for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

This configuration allows for easier integration into circuits, enhancing versatility and reducing design complexity.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET is perfect for audio and radio frequency applications, ensuring high gain and performance.

Surface Mount: YES

Being surface mount compatible, this FET enables compact circuit designs and efficient use of board space.

Minimum DS Breakdown Voltage: 7 V

This voltage level offers sufficient protection against overvoltage conditions, enhancing circuit reliability.

Package Shape: RECTANGULAR

The rectangular package shape provides a stable footprint for mounting on PCBs, facilitating robust connections.

Terminal Form: GULL WING

The gull wing terminal form ensures excellent solderability and mechanical stability on circuit boards, which is critical for high reliability.

Operating Mode: DUAL GATE, ENHANCEMENT MODE

The dual gate configuration allows for better control over device operation, making it suitable for advanced RF applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating in the ultra-high frequency band, this FET is ideal for applications such as RF amplification and signal processing.

No. of Terminals: 4

The 4-terminal design helps simplify circuit layout and connection points, making it easier to incorporate into various applications.

Package Style (Meter): SMALL OUTLINE

The small outline style minimizes PCB space usage while allowing for effective thermal management and electrical performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances performance, providing high input impedance and low power consumption, which is perfect for battery-operated devices.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can function in demanding environments, thus ensuring reliability under stress.

Transistor Element Material: SILICON

Silicon as the element material offers good thermal conductivity and electrical characteristics, enhancing performance stability.

Maximum Drain Current (ID): 0.03 A

This current rating makes the FET suitable for low to moderate power applications where space and efficiency are critical.

Terminal Position: DUAL

Dual terminal positioning allows for effective connection routing in complex circuits, facilitating design flexibility.

Case Connection: SOURCE

With the source connected to the case, this design helps in effective thermal management and enhances performance.

Maximum Feedback Capacitance (Crss): 0.035 pF

Low feedback capacitance improves high-frequency performance, making this FET ideal for precision RF applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF904R-TAPE-13 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

7 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.035 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF904R-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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