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BF1105R,215

NXP Semiconductors

BF1105R,215 by NXP Semiconductors

BF1105R,215 by NXP Semiconductors is an N-CHANNEL RF FET with a PLASTIC/EPOXY package. It operates in DUAL GATE ENHANCEMENT MODE at 150°C max temp. Ideal for AMPLIFIER applications in ULTRA HIGH FREQUENCY BAND due to its 0.03 A drain current and 0.04 pF feedback capacitance.

Median Price

$0.218

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 38 parts In-Stock

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Vyrian

USA . 3,726 parts In-Stock

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VNN

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Flip Electronics

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Anansix

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Digiode

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Aranea Global

USA . 50 parts In-Stock

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$0.214

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$0.205

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Continental Prestige Electronics

USA . 6,999 parts In-Stock

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Argo Parts USA

USA . 4,607 parts In-Stock

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Corohmni

South Africa . 18 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,952 parts In-Stock

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AZTECH Wire

Italy . 348 parts In-Stock

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One Stop Electronics

USA . 901 parts In-Stock

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$33.050

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Ampacity Inc.

Singapore . 1,062 parts In-Stock

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Perfect Parts

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UNI Independent Distributors

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Corphita

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Microchip USA

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Overview

Unleash the power of cutting-edge technology with the BF1105R,215 by NXP Semiconductors. Crafted with precision and expertise, this RF Small Signal Field Effect Transistor (FET) offers unparalleled performance in amplifier applications. Its N-CHANNEL configuration and DUAL GATE, ENHANCEMENT MODE operation ensure optimal functionality in the ULTRA HIGH FREQUENCY BAND. With a sleek PLASTIC/EPOXY body and GULL WING terminals, this transistor is designed for seamless integration. Elevate your projects with the reliability and innovation that only NXP Semiconductors can deliver. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Offers efficient signal amplification in N-channel configurations.

Transistor Application: AMPLIFIER

Designed specifically for amplification applications, ensuring optimal performance.

Surface Mount: YES

Facilitates easy installation and maintenance in circuit boards.

Minimum DS Breakdown Voltage: 7 V

Can handle high voltages, increasing the range of applications for the transistor.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Suitable for applications requiring operation in ultra high frequency ranges.

Maximum Drain Current (ID): 0.03 A

Capable of handling moderate current loads efficiently.

No. of Terminals: 4

Provides necessary connections for proper functioning in the circuit.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes advanced technology for efficient signal amplification and control.

Maximum Operating Temperature: 150 °C

Can operate effectively in high temperature environments.

Terminal Finish: Tin (Sn)

Provides a reliable and stable connection for the transistor.

Maximum Feedback Capacitance (Crss): 0.04 pF

Minimizes feedback capacitance for improved signal performance.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF1105R,215 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

7 V

Maximum Drain Current (Abs) (ID):

.03 A

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.04 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF1105R,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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