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BF992-TAPE-7

NXP Semiconductors

BF992-TAPE-7 by NXP Semiconductors

BF992-TAPE-7 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a max DS breakdown voltage of 20V, operates in dual gate mode, and supports very high frequency bands. This compact surface mount device ensures efficient performance in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,496 parts In-Stock

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3,496

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Vyrian

USA . 3,112 parts In-Stock

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3,112

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Anansix

USA . 797 parts In-Stock

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797

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Native Components

USA . 778 parts In-Stock

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$0.751

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778

$0.751

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Northwest PG Solutions

USA . 1,733 parts In-Stock

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$0.826

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1,733

$0.826

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One Stop Electronics

USA . 1,211 parts In-Stock

1+ parts

$54.050

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1,211

$54.050

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UNI Independent Distributors

Spain . 6,723 parts In-Stock

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6,723

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Corphita

USA . 1,956 parts In-Stock

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Overview

Unlock superior performance with the BF992-TAPE-7 from NXP Semiconductors! This high-quality RF small signal FET is designed for amplifying applications, combining reliability and exceptional efficiency. With its innovative dual-gate technology, it ensures optimal signal clarity even in demanding environments. Trust in NXP’s legacy of excellence to elevate your designs, offering unparalleled value and precision for all your electronic projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction provides durability and protection against environmental factors, making it reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their efficiency and higher electron mobility, making them ideal for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances circuit protection and allows for simpler designs by integrating multiple functions into a single component.

Transistor Application: AMPLIFIER

Designed for amplification, this FET is suitable for audio and RF applications, providing high gain and signal fidelity.

Surface Mount: YES

Surface mount technology allows for smaller circuit designs and increased production efficiency, which is advantageous for modern electronics.

Minimum DS Breakdown Voltage: 20 V

A minimum breakdown voltage of 20V ensures reliable operation in a variety of environments and prevents device failure under high voltage stress.

Package Shape: RECTANGULAR

The rectangular shape is conducive to compact layout designs, optimizing space requirements on PCBs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance the mechanical stability of the component on the PCB.

Operating Mode: DUAL GATE, DEPLETION MODE

This versatile operating mode allows for greater control over the device's characteristics, suitable for specific circuit configurations.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Capable of operating in very high frequency bands, this FET is ideal for RF applications, ensuring effective signal handling.

No. of Terminals: 4

Four terminals provide flexibility in circuit designs and simplified connections to other components.

Package Style (Meter): SMALL OUTLINE

A small outline package minimizes space on the PCB, allowing for more compact and efficient electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables low power consumption and high-speed operation, making it suitable for battery-operated devices.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows for reliable performance in harsh environments, ensuring longevity and stability.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material that provides excellent performance and stability in transistor applications.

Maximum Drain Current (ID): 0.04 A

The maximum drain current of 0.04 A is ample for many application requirements, providing flexibility in circuit design.

Terminal Position: DUAL

Dual terminal positions enhance circuit integration options, allowing for a variety of application possibilities.

Case Connection: SOURCE

The source connection improves grounding and overall circuit stability, which is essential for consistent operation.

Maximum Feedback Capacitance (Crss): 0.04 pF

Low feedback capacitance contributes to higher frequency performance and reduced signal distortion in circuits, making this FET ideal for RF applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF992-TAPE-7 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

.04 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.04 pF

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF992-TAPE-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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