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BF511-TAPE-13

NXP Semiconductors

BF511-TAPE-13 by NXP Semiconductors

BF511-TAPE-13 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a max DS breakdown voltage of 20V, operates in depletion mode, and supports very high frequencies. This compact surface mount transistor ensures reliable performance up to 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,415 parts In-Stock

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3,415

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Digiode

USA . 2,346 parts In-Stock

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2,346

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Anansix

USA . 1,284 parts In-Stock

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1,284

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Distributors (Availability)

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One Stop Electronics

USA . 951 parts In-Stock

1+ parts

$52.050

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951

$52.050

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Native Components

USA . 201 parts In-Stock

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$95.319

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$91.506

201

$95.319

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$91.506

Northwest PG Solutions

USA . 805 parts In-Stock

1+ parts

$104.851

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805

$104.851

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Corphita

USA . 2,650 parts In-Stock

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2,650

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UNI Independent Distributors

Spain . 540 parts In-Stock

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540

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Overview

Unlock superior performance with the BF511-TAPE-13 from NXP Semiconductors, where quality meets innovation in RF small signal FETs. Designed for amplifying signals in high-frequency applications, this robust yet compact transistor ensures reliability and efficiency. With NXP's trusted expertise, enjoy enhanced durability and exceptional thermal performance, making it the ideal choice for your next project. Experience the difference with unmatched value and precision!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures lightweight construction and excellent resistance to environmental conditions, making it ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer higher efficiency and faster switching speeds, making this FET suitable for high-performance amplifier applications.

Configuration: SINGLE

A single configuration allows for simpler designs and is easier to integrate into circuit boards, enhancing usability in compact electronics.

Transistor Application: AMPLIFIER

Designed for amplification, this FET is suited for audio and RF applications, delivering clear signal processing and high fidelity.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space, enabling thinner and lighter devices, which is critical in modern electronics.

Minimum DS Breakdown Voltage: 20 V

A minimum breakdown voltage of 20 V provides robust performance in various applications, ensuring stability in high-voltage environments.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy mounting and optimal PCB layout, which is essential for maintaining a compact design.

Terminal Form: GULL WING

Gull wing terminals offer good solder joints and mechanical stability, ensuring reliable connections in demanding applications.

Operating Mode: DEPLETION MODE

Operating in depletion mode allows for lower power consumption in standby states, making this FET energy-efficient.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Optimized for very high frequency operations, this FET is perfect for RF amplification, ensuring high-frequency signal fidelity.

No. of Terminals: 3

The 3-terminal configuration simplifies circuit integration and supports versatile circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes this FET ideal for space-constrained applications, facilitating compact circuit designs.

Field Effect Transistor Technology: JUNCTION

Junction FET technology offers superior input impedance, which is advantageous in high-impedance circuit applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand harsh environments, expanding its usability in industrial applications.

Transistor Element Material: SILICON

Silicon as a transistor element material ensures reliable performance and favorable electrical characteristics, typical of high-quality FETs.

Maximum Drain Current (ID): 0.03 A

A maximum drain current rating of 0.03 A allows for adequate handling of signal currents in a variety of applications without overheating.

Terminal Position: DUAL

Dual terminal positions enhance the versatility of the FET in circuit layouts, making it easier to incorporate into various designs.

Maximum Feedback Capacitance (Crss): 0.4 pF

A low feedback capacitance of 0.4 pF reduces signal distortion, making this FET suitable for high-fidelity applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF511-TAPE-13 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

.4 pF

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF511-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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