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BF512-TAPE-13

NXP Semiconductors

BF512-TAPE-13 by NXP Semiconductors

BF512-TAPE-13 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a 20V min DS breakdown voltage, operates in depletion mode, and supports very high frequency bands. This compact surface mount transistor ensures reliable performance up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,466 parts In-Stock

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Digiode

USA . 586 parts In-Stock

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586

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Anansix

USA . 319 parts In-Stock

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319

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Distributors (Availability)

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One Stop Electronics

USA . 239 parts In-Stock

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$7.050

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239

$7.050

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Native Components

USA . 115 parts In-Stock

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$9.300

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Northwest PG Solutions

USA . 962 parts In-Stock

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$10.230

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$9.207

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962

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UNI Independent Distributors

Spain . 4,366 parts In-Stock

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Corphita

USA . 4,172 parts In-Stock

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Overview

Unlock unparalleled performance with the BF512-TAPE-13 from NXP Semiconductors, a leader in innovative solutions. Designed for RF applications, this N-channel FET excels in amplification while ensuring reliability and efficiency. Its compact, surface-mount design allows for seamless integration into high-frequency circuits, elevating your projects to new heights. Choose NXP for quality you can trust—maximize your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

As an N-channel FET, this product provides efficient electron mobility, resulting in faster switching speeds and higher performance in amplifying signals.

Configuration: SINGLE

A single configuration simplifies design and integration into circuits, reducing complexity in assembly and operation.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, it ensures high fidelity and effective amplification of signals.

Surface Mount: YES

Surface mount technology allows for low-profile designs and automated assembly, making it easy to integrate in modern PCBs.

Minimum DS Breakdown Voltage: 20 V

With a minimum DS breakdown voltage of 20 V, this FET can handle moderate voltage levels, adding versatility for various circuit designs.

Package Shape: RECTANGULAR

The rectangular shape is efficient for layout and space management on circuit boards, enabling better use of available area.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics and mechanical strength, ensuring reliable connections in the circuit.

Operating Mode: DEPLETION MODE

In depletion mode, the transistor can operate at lower voltages, providing excellent control over the current and enhancing circuit efficiency.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

The ability to operate in very high frequency bands makes this FET suitable for high-speed applications and advanced communication systems.

No. of Terminals: 3

A three-terminal configuration offers versatility for connection and functionality while maintaining simplicity in design.

Package Style (Meter): SMALL OUTLINE

The small outline style helps save space on circuit boards, making it ideal for compact and portable electronic devices.

Field Effect Transistor Technology: JUNCTION

Utilizing junction technology enhances thermal stability and performance, contributing to reliable operation under various conditions.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C ensures reliability and performance in demanding environments, suitable for industrial applications.

Transistor Element Material: SILICON

Silicon as the material ensures good electrical properties and durability, making it a standard and reliable choice for FET applications.

Maximum Drain Current (ID): 0.03 A

With a maximum drain current of 0.03 A, this FET can handle moderate power requirements, making it effective for small to medium-scale applications.

Terminal Position: DUAL

Dual-terminal positioning contributes to flexible circuit designs and simplifies connection options in PCB layouts.

Maximum Feedback Capacitance (Crss): 0.4 pF

A low maximum feedback capacitance of 0.4 pF minimizes unwanted capacitance effects, enhancing signal integrity and performance.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF512-TAPE-13 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

.4 pF

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF512-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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