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MMBF4416LT1G

Onsemi

MMBF4416LT1G by Onsemi

MMBF4416LT1G by Onsemi is an N-CHANNEL RF FET with 30V DS breakdown voltage and 10dB power gain, ideal for amplifier applications. It operates in depletion mode at ultra-high frequencies, with a max power dissipation of 0.225W. The transistor features a gull wing terminal form and tin finish, suitable for surface mount configurations in small outline packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 5,815 parts In-Stock

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Chip Stock

USA . 4,310 parts In-Stock

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Digiode

USA . 1,322 parts In-Stock

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Nova Conductors

Japan . 27 parts In-Stock

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Ampacity Inc.

Singapore . 771 parts In-Stock

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$3.050

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771

$3.050

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AZTECH Wire

Italy . 605 parts In-Stock

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$8.865

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Component Stockers USA

USA . 635 parts In-Stock

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$99.990

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635

$99.990

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Kepictronics

USA . 54,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 29,215 parts In-Stock

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Kulean Microsystems

USA . 6,646 parts In-Stock

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Metaverse IC Inc.

Canada . 6,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,813 parts In-Stock

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SupplyDigital Components

Austria . 5,561 parts In-Stock

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Continental Prestige Electronics

USA . 5,302 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 4,156 parts In-Stock

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Problanco Electronics

Mexico . 2,995 parts In-Stock

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Lixinc

USA . 2,748 parts In-Stock

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Corphita

USA . 1,589 parts In-Stock

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Andel Nordic

Denmark . 1,283 parts In-Stock

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Argo Parts USA

USA . 1,262 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Corohmni

South Africa . 382 parts In-Stock

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UHIMA Technologies

Türkiye . 110 parts In-Stock

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Overview

Elevate your RF amplifier performance with the MMBF4416LT1G by Onsemi! This top-quality N-CHANNEL FET is designed for ultra-high frequency applications, offering a power gain of 10 dB and a minimum breakdown voltage of 30V. With its small outline package and gull wing terminals, this transistor is perfect for compact and high-performance designs. Trust Onsemi's reputation for excellence in semiconductor technology to deliver unparalleled reliability and efficiency. Upgrade your amplifier circuits today with the MMBF4416LT1G and experience the difference in quality and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan.

Configuration: SINGLE

Simplifies circuit design and integration with other components.

Transistor Application: AMPLIFIER

Ideal for use in amplification circuits, providing increased signal strength.

Minimum DS Breakdown Voltage: 30 V

Handles higher voltages, making it suitable for a wide range of applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Suitable for high-frequency applications, ensuring efficient signal processing.

Maximum Power Dissipation (Abs): 0.225 W

Can handle higher power levels without overheating, ensuring stability in operation.

Field Effect Transistor Technology: JUNCTION

Provides reliability and performance in signal amplification and processing.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, making it suitable for various operating environments.

Terminal Finish: TIN

Ensures good conductivity and corrosion resistance for reliable connections.

Maximum Feedback Capacitance (Crss): 0.8 pF

Low capacitance minimizes signal loss and distortion.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) MMBF4416LT1G attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

30 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

.8 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Minimum Power Gain (Gp):

10 dB

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MMBF4416LT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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