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BF992R-TAPE-13

NXP Semiconductors

BF992R-TAPE-13 by NXP Semiconductors

BF992R-TAPE-13 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a max DS breakdown voltage of 20V, operates in dual gate mode, and supports very high frequency bands. Its compact surface mount design ensures efficient performance in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 4,142 parts In-Stock

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Vyrian

USA . 3,669 parts In-Stock

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Anansix

USA . 1,763 parts In-Stock

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One Stop Electronics

USA . 263 parts In-Stock

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$5.050

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UNI Independent Distributors

Spain . 1,282 parts In-Stock

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Corphita

USA . 1,214 parts In-Stock

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Northwest PG Solutions

USA . 1,156 parts In-Stock

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Native Components

USA . 814 parts In-Stock

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Overview

Unlock unparalleled performance with the BF992R-TAPE-13 from NXP Semiconductors, a leader in high-quality RF solutions. This N-channel FET is designed for superior amplification and operates efficiently in very high-frequency applications. Its robust construction ensures reliability, making it ideal for cutting-edge consumer electronics and communication systems. Elevate your designs with this versatile component, offering exceptional value and unmatched benefits for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body offers good protection against environmental factors, increasing the reliability and longevity of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally provide better performance and efficiency in amplification applications, making this product suitable for high-frequency electronics.

Configuration: SINGLE WITH BUILT-IN DIODE

The integration of a built-in diode simplifies circuit design and improves overall efficiency, reducing external component count.

Transistor Application: AMPLIFIER

Designed for amplifier applications, this FET can effectively boost signal strength in communication systems and other audio applications.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB designs, facilitating modern electronic applications with space constraints.

Minimum DS Breakdown Voltage: 20 V

A minimum breakdown voltage of 20V ensures adequate performance in various applications, providing robustness against voltage spikes.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient PCB layout and space optimization, essential for modern electronic design.

Terminal Form: GULL WING

Gull wing terminals enhance solderability and provide mechanical stability, contributing to reliable connections in surface mount assemblies.

Operating Mode: DUAL GATE, DEPLETION MODE

The dual gate operation allows for enhanced control and modulation, making this FET versatile for various high-frequency applications.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

This specification indicates the transistor's capability to operate effectively at very high frequencies, making it ideal for RF applications like amplifiers and oscillators.

No. of Terminals: 4

The 4-terminal design provides multiple connection points for better performance and integration into complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for space-efficient designs, facilitating use in compact devices while maintaining high performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances speed and efficiency, making this FET suitable for high-performance applications in telecommunications and consumer electronics.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can function reliably in demanding environments, ensuring performance stability.

Transistor Element Material: SILICON

Silicon is widely used due to its excellent electrical properties and thermal stability, making the transistor both effective and cost-efficient.

Maximum Drain Current (ID): 0.04 A

A maximum drain current of 0.04 A makes this FET suitable for low-power applications while providing significant control over the output.

Terminal Position: DUAL

The dual terminal position enhances connectivity options, allowing for flexible design choices in various circuit applications.

Case Connection: SOURCE

With a source-case connection, the design optimizes thermal performance, facilitating effective heat dissipation and enhancing reliability.

Maximum Feedback Capacitance (Crss): 0.04 pF

A low feedback capacitance of 0.04 pF ensures minimal signal degradation, making this FET ideal for high-speed and precision applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF992R-TAPE-13 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

.04 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.04 pF

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF992R-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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