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BF908R-TAPE-7

NXP Semiconductors

BF908R-TAPE-7 by NXP Semiconductors

BF908R-TAPE-7 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a max DS breakdown voltage of 12V, operates in the ultra-high frequency band, and supports dual gate depletion mode. Ideal for compact surface mount designs, it ensures efficient performance in various electronic circuits.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 4,729 parts In-Stock

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Digiode

USA . 2,539 parts In-Stock

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Anansix

USA . 1,112 parts In-Stock

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One Stop Electronics

USA . 437 parts In-Stock

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UNI Independent Distributors

Spain . 8,371 parts In-Stock

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Corphita

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Native Components

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Northwest PG Solutions

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Overview

Unlock superior performance with the BF908R-TAPE-7 from NXP Semiconductors, a leader in innovative RF solutions. Designed for ultra-high frequency applications, this N-channel FET delivers exceptional amplification while ensuring durability with its resilient plastic/epoxy body. Ideal for cutting-edge electronics, it enhances signal clarity and efficiency, making it the perfect choice for engineers seeking reliability and advancement in their designs. Elevate your projects with this trusted component!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and effective protection from environmental factors, making the product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and lower on-resistance, enhancing the efficiency and responsiveness in amplification applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional functionality such as protection against parasitic effects, making it versatile for various circuit applications.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this transistor can deliver superior signal processing capabilities, ideal for RF applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient automated assembly, making it suitable for modern circuit designs.

Minimum DS Breakdown Voltage: 12 V

A DS breakdown voltage of 12V ensures reliable operation in applications where moderate voltage levels are present.

Package Shape: RECTANGULAR

The rectangular package shape provides a stable footprint, which is beneficial for circuit layout and design flexibility.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and connection to printed circuit boards, enhancing assembly efficiency.

Operating Mode: DUAL GATE, DEPLETION MODE

This operating mode allows for finer control over the transistor's operation, making it advantageous for specialized signal processing tasks.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capability to operate in the ultra-high frequency band makes this FET suitable for advanced RF and microwave applications.

No. of Terminals: 4

The 4-terminal configuration provides sufficient connection points for efficient handling of input and output signals.

Package Style (Meter): SMALL OUTLINE

The small outline design is space-efficient, making it ideal for compact electronic devices and minimizing PCB real estate usage.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance, making it less costly to drive and ensuring lower power consumption.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C enables the FET to perform reliably in demanding thermal environments.

Transistor Element Material: SILICON

The use of silicon as the element material is standard for FETs, providing excellent electrical properties and performance.

Maximum Drain Current (ID): 0.04 A

A drain current rating of 0.04 A supports moderate power applications, making it suitable for many signal amplification tasks.

Terminal Position: DUAL

Dual terminal positions allow for versatile connection options in circuit designs, improving layout flexibility.

Case Connection: SOURCE

Having the case connected to the source improves thermal stability and performance, which is critical for high-frequency applications.

Maximum Feedback Capacitance (Crss): 0.045 pF

Low feedback capacitance allows for higher frequency performance, reducing signal distortion and improving overall fidelity in RF applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF908R-TAPE-7 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (ID):

.04 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.045 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF908R-TAPE-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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