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J309RLRP

Onsemi

J309RLRP by Onsemi

J309RLRP by Onsemi is an N-CHANNEL RF FET with a 25V DS Breakdown Voltage, ideal for AMPLIFIER applications in the ULTRA HIGH FREQUENCY BAND. Featuring a DEPLETION MODE and SILICON element material, this THROUGH-HOLE transistor operates at up to 125 °C with a Crss of 2.5 pF.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 1,673 parts In-Stock

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Digiode

USA . 1,236 parts In-Stock

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SupplyDigital Components

Austria . 6,277 parts In-Stock

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Problanco Electronics

Mexico . 5,872 parts In-Stock

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Kulean Microsystems

USA . 3,977 parts In-Stock

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Corphita

USA . 1,073 parts In-Stock

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UHIMA Technologies

Türkiye . 418 parts In-Stock

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Corohmni

South Africa . 304 parts In-Stock

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TANS Electronics

Latvia . 246 parts In-Stock

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Overview

Unleash the power of innovation with the J309RLRP RF Small Signal Field Effect Transistor by Onsemi. Crafted with precision and expertise, this N-CHANNEL transistor offers unparalleled performance in amplifier applications within the ultra-high frequency band. Its durable plastic/epoxy package ensures reliability while its depletion mode operation guarantees optimal functionality. Elevate your projects with the superior quality and cutting-edge technology of Onsemi's J309RLRP, delivering value, efficiency, and excellence to every customer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors offer high efficiency and fast switching speeds, making them ideal for amplifier applications.

Configuration: SINGLE

The single configuration simplifies the circuit design and allows for easier integration into electronic devices.

Minimum DS Breakdown Voltage: 25 V

The high breakdown voltage ensures the transistor can handle higher voltages without malfunctioning.

Package Shape: ROUND

The round package shape allows for easy mounting and efficient use of space in electronic designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure connection and ease of soldering during assembly.

Operating Mode: DEPLETION MODE

Depletion mode transistors offer precise control over the current flow, making them suitable for amplifier applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

The ultra-high frequency band capability allows for high-speed signal amplification and processing.

No. of Terminals: 3

The 3 terminals provide the necessary connections for power, signal input, and output in amplifier circuits.

Package Style (Meter): CYLINDRICAL

The cylindrical package style offers a compact form factor and easy integration into electronic designs.

Field Effect Transistor Technology: JUNCTION

Junction FET technology provides high performance and reliability in amplifier applications.

Maximum Operating Temperature: 125 °C

The high operating temperature range ensures the transistor can function reliably in various environmental conditions.

Transistor Element Material: SILICON

Silicon transistors offer low power consumption and high efficiency, making them ideal for amplifier applications.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides good solderability and stable electrical connections for the transistor.

Terminal Position: BOTTOM

The bottom terminal position simplifies the layout and connection in circuit designs.

Maximum Feedback Capacitance (Crss): 2.5 pF

The low feedback capacitance minimizes signal distortion and interference in amplifier circuits.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) J309RLRP attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

2.5 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

125 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

J309RLRP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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