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J309RLRE

Onsemi

J309RLRE by Onsemi

J309RLRE by Onsemi is an N-CHANNEL RF FET with a 25V DS Breakdown Voltage, ideal for AMPLIFIER applications. Operating in DEPLETION MODE, it offers ULTRA HIGH FREQUENCY performance and features a 2.5pF Max Crss. This CYLINDRICAL transistor has a max temp of 125 °C and uses SILICON technology with TIN LEAD finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 734 parts In-Stock

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734

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Digiode

USA . 550 parts In-Stock

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550

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SupplyDigital Components

Austria . 8,100 parts In-Stock

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TANS Electronics

Latvia . 7,206 parts In-Stock

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Problanco Electronics

Mexico . 7,056 parts In-Stock

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Kulean Microsystems

USA . 4,048 parts In-Stock

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UHIMA Technologies

Türkiye . 744 parts In-Stock

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Corohmni

South Africa . 214 parts In-Stock

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Corphita

USA . 200 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the J309RLRE by Onsemi. As a leader in RF Small Signal Field Effect Transistors, Onsemi guarantees top-notch quality and reliability. Ideal for amplifier applications in the ultra-high frequency band, this N-CHANNEL transistor offers unparalleled performance. With a minimum DS breakdown voltage of 25V and a maximum operating temperature of 125 °C, this transistor is designed to exceed expectations. Elevate your projects with the J309RLRE and experience the difference in quality and precision that Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the transistor, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically offer better performance and efficiency compared to P-Channel transistors, making them a good choice for certain applications.

Configuration: SINGLE

Single configuration simplifies circuit design and makes the transistor easier to integrate into systems.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in amplification circuits.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this transistor can handle higher voltages without damage, making it suitable for a variety of applications.

Package Shape: ROUND

Round package shape allows for easy mounting and installation in circular spaces or PCB layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer strong mechanical connection and easy soldering, making the transistor suitable for through-hole PCB assembly.

Operating Mode: DEPLETION MODE

Depletion mode operation allows for better control and flexibility in circuit design, making this transistor versatile for different applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency applications, this transistor is suitable for high-speed communication and signal processing systems.

No. of Terminals: 3

With 3 terminals, this transistor can easily interface with external components and circuitry, enhancing versatility in circuit design.

Package Style (Meter): CYLINDRICAL

Cylindrical package style provides a compact form factor for space-constrained applications and easy integration in system designs.

Field Effect Transistor Technology: JUNCTION

Junction technology offers high performance and reliability, ensuring stable operation in demanding environments.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this transistor can withstand high-temperature environments, making it suitable for industrial applications.

Transistor Element Material: SILICON

Silicon material provides excellent electrical properties, ensuring high performance and reliability in various applications.

Terminal Finish: TIN LEAD

Tin lead finish on terminals offers good conductivity and solderability, making it easy to integrate the transistor into circuit assemblies.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, making it easier to design circuits with this transistor.

Maximum Feedback Capacitance (Crss): 2.5 pF

With a low feedback capacitance of 2.5pF, this transistor minimizes signal distortion and interference, ensuring high-quality amplification.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) J309RLRE attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

2.5 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

125 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

J309RLRE Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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