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BF901-TAPE-7

NXP Semiconductors

BF901-TAPE-7 by NXP Semiconductors

BF901-TAPE-7 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications, featuring a 12V min breakdown voltage and operating in the ultra-high frequency band. It has a compact SO package with gull-wing terminals. This dual-gate enhancement mode transistor operates at up to 150 °C.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 3,831 parts In-Stock

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Digiode

USA . 2,015 parts In-Stock

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Anansix

USA . 273 parts In-Stock

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Northwest PG Solutions

USA . 968 parts In-Stock

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$2.376

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One Stop Electronics

USA . 1,469 parts In-Stock

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$4.050

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Corphita

USA . 3,986 parts In-Stock

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UNI Independent Distributors

Spain . 3,134 parts In-Stock

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Native Components

USA . 939 parts In-Stock

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$2.095

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Overview

Unlock unparalleled performance with the BF901-TAPE-7 from NXP Semiconductors, a leader in innovative technology. Designed for RF applications, this high-quality N-channel FET excels in amplification, offering excellent reliability and efficiency. With its compact, surface-mount design and dual-gate enhancement mode, it effortlessly meets the demands of ultra-high frequency scenarios. Elevate your projects—experience superior quality and unmatched value with NXP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection, making the transistor suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for lower on-resistance and efficiency, making them ideal for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode helps protect against reverse polarity and improves reliability, making this product more robust.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this transistor is suitable for audiophiles and audio applications where sound quality is crucial.

Surface Mount: YES

Surface mount capability allows for compact designs and automated assembly processes, enhancing manufacturing efficiency.

Minimum DS Breakdown Voltage: 12 V

With a breakdown voltage of 12V, it offers a robust safety margin for various applications, reducing the risk of damage.

Package Shape: RECTANGULAR

The rectangular shape improves layout flexibility on PCBs, optimizing space utilization in electronic devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering area, ensuring strong mechanical and electrical connections on PCB.

Operating Mode: DUAL GATE, ENHANCEMENT MODE

Dual gate functionality enhances control over device performance, making it advantageous for sophisticated circuit designs.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of operating in ultra-high frequency applications, this FET is suitable for advanced telecommunications and RF applications.

No. of Terminals: 4

Having 4 terminals allows for more versatile circuit configurations, enabling additional functionality and control.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space in electronic designs, making it preferred for compact and portable devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, contributing to energy-efficient designs.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor is capable of functioning in higher thermal environments, ensuring reliability.

Transistor Element Material: SILICON

Silicon is a well-established semiconductor material that offers excellent electrical properties, ensuring consistent performance.

Maximum Drain Current (ID): 0.03 A

A maximum drain current of 0.03 A makes this device suitable for low-power applications while still providing reliable performance.

Terminal Position: DUAL

Dual terminal positions facilitate easier layout and design, allowing for greater flexibility in PCB design.

Case Connection: SOURCE

Source case connection enhances thermal management and allows for better performance in various circuit configurations.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF901-TAPE-7 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF901-TAPE-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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