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BF513,215

NXP Semiconductors

BF513,215 by NXP Semiconductors

The NXP Semiconductors BF513,215 is a single N-channel RF FET with a max power dissipation of 0.25W and operating temperature of 150°C. Ideal for amplifier applications in the very high frequency band, it features a min DS breakdown voltage of 20V and terminal finish in Tin (Sn).

Median Price

$0.151

Lifecycle Status

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7

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1k+

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Verical

USA . 5,027 parts In-Stock

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Chip1Stop

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Nova Conductors

Japan . 100 parts In-Stock

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Vyrian

USA . 9,596 parts In-Stock

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Ampacity Inc.

Singapore . 2,537 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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AZTECH Wire

Italy . 931 parts In-Stock

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Perfect Parts

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Overview

Discover the cutting-edge BF513,215 RF Small Signal Field Effect Transistor from NXP Semiconductors, a trusted manufacturer known for top-quality components. Ideal for amplifier applications, this N-CHANNEL transistor operates in depletion mode and offers very high frequency performance. With a package shape and style designed for easy mounting, this transistor provides a breakthrough solution for your electronic projects. Experience superior performance and reliability with the BF513,215 - the ultimate choice for amplification needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors are commonly used in amplifiers and other electronic devices, offering good performance in such applications.

Configuration: SINGLE

A single configuration simplifies the design and integration of the transistor into circuitry, enhancing ease of use.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring high performance and reliability in amplifying signals.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle higher voltages, suitable for various signal processing applications.

Package Shape: RECTANGULAR

Rectangular shape provides a compact form factor, making it easier to fit into tight spaces on circuit boards.

Terminal Form: GULL WING

Gull Wing terminals offer better mechanical strength and improved solder joint quality, ensuring reliable connections.

Operating Mode: DEPLETION MODE

Depletion mode operation allows for easy control of current flow, making the transistor versatile in different circuit configurations.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Capable of operating in very high frequency bands, ideal for applications requiring fast signal processing and high data rates.

No. of Terminals: 3

With 3 terminals, the transistor can be easily connected in circuits, providing flexibility in design and functionality.

Maximum Power Dissipation (Abs): 0.25 W

With a maximum power dissipation of 0.25W, the transistor can handle moderate power levels without overheating, ensuring reliable operation.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on circuit boards, making it suitable for compact electronic devices and designs.

Field Effect Transistor Technology: JUNCTION

Junction technology offers high performance and efficiency, making the transistor suitable for various signal processing applications.

Maximum Operating Temperature: 150 °C

Capable of operating at temperatures up to 150°C, ensuring stable performance in harsh environments or high-temperature conditions.

Transistor Element Material: SILICON

Silicon material provides good electrical properties, enhancing the performance and reliability of the transistor.

Terminal Finish: Tin (Sn)

Tin terminal finish offers good solderability, ensuring reliable connections and easy assembly in circuit boards.

Maximum Drain Current (ID): 0.03 A

With a maximum drain current of 0.03A, the transistor can handle moderate current levels, suitable for various electronic applications.

Terminal Position: DUAL

Dual terminal position provides flexibility in connecting the transistor in different circuit configurations, enhancing versatility.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

Capable of withstanding high peak reflow temperatures up to 260°C, ensuring proper soldering and reliability during assembly.

Maximum Feedback Capacitance (Crss): 0.4 pF

With a maximum feedback capacitance of 0.4pF, the transistor offers good high-frequency performance and stability in signal processing.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF513,215 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Configuration:

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

.4 pF

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF513,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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