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BF510

NXP Semiconductors

BF510 by NXP Semiconductors

N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .25 W; Terminal Position: DUAL; Highest Frequency Band: VERY HIGH FREQUENCY BAND;

Median Price

$1.125

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,720 parts In-Stock

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Vyrian

USA . 2,112 parts In-Stock

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Goldney Electronics S.L.

Spain . 1,100 parts In-Stock

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Anansix

USA . 1,064 parts In-Stock

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Bristol Electronics

USA . 60 parts In-Stock

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$1.125

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Microfarads

USA . 56 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 24 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 662 parts In-Stock

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$18.276

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662

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Northwest PG Solutions

USA . 2,164 parts In-Stock

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$20.104

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$18.093

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One Stop Electronics

USA . 276 parts In-Stock

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$35.050

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276

$35.050

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Metaverse IC Inc.

Canada . 306,000 parts In-Stock

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 13,353 parts In-Stock

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Microchip USA

USA . 11,168 parts In-Stock

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A-Z Elektronik GmbH

Germany . 9,239 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,159 parts In-Stock

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UNI Independent Distributors

Spain . 2,713 parts In-Stock

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Assy Fe

Spain . 1,835 parts In-Stock

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Kepictronics

USA . 1,450 parts In-Stock

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Corphita

USA . 106 parts In-Stock

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Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF510 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Configuration:

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

.4 pF

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF510 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00

NSN

4940-01-462-9785, 4940014629785, 6515-01-473-2216, 6515014732216

NIIN

014629785, 014732216

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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