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BF980

NXP Semiconductors

BF980 by NXP Semiconductors

BF980 by NXP Semiconductors is an N-channel RF FET designed for ultra-high frequency applications. It features a min DS breakdown voltage of 18V and operates in dual gate, depletion mode. Its ceramic, metal-sealed package ensures reliability in compact designs.

Median Price

$14.420

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 104 parts In-Stock

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Vyrian

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Digiode

USA . 1,368 parts In-Stock

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Holdelec - ElecDif-Pro

France . 1,146 parts In-Stock

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Anansix

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Fibra_Brandt Electronic GMBH

Germany . 600 parts In-Stock

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Manotoh

Italy . 248 parts In-Stock

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Odintec Ltd.

Israel . 205 parts In-Stock

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ECAB

Sweden . 45 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 35 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 30 parts In-Stock

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Electronics Depot

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LittleDiode

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Native Components

USA . 87 parts In-Stock

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$0.837

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Northwest PG Solutions

USA . 1,553 parts In-Stock

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$0.921

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One Stop Electronics

USA . 1,021 parts In-Stock

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$3.050

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Kepictronics

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Alle Elektronik GmbH

Germany . 4,668 parts In-Stock

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UNI Independent Distributors

Spain . 1,198 parts In-Stock

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Corphita

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Assy Fe

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Overview

Unlock superior performance with the BF980 from NXP Semiconductors, a leader in innovative RF solutions. This high-quality N-channel FET is designed for ultra-high frequency applications, delivering unmatched efficiency and reliability. Its robust ceramic and metal-sealed package ensures durability while simplifying surface mount integration. Elevate your designs with the BF980, where cutting-edge technology meets outstanding value—perfect for telecommunications, broadcasting, and beyond!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired construction ensures excellent thermal stability and reliability, making it ideal for demanding applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher performance and efficiency, allowing for faster switching and better conduction, making them suitable for RF applications.

Configuration: SINGLE

With a single configuration, this FET is easy to integrate into designs, providing a compact solution while maintaining effective performance.

Surface Mount: YES

The surface mount design allows for efficient space utilization on PCBs, facilitating automated assembly and reducing overall production costs.

Minimum DS Breakdown Voltage: 18 V

A minimum breakdown voltage of 18 V enhances the device's reliability in higher voltage applications, providing a safety margin in critical environments.

Package Shape: ROUND

The round package shape offers improved thermal dissipation properties, contributing to enhanced device performance at high frequencies.

Terminal Form: FLAT

Flat terminals facilitate better electrical connection and stability on the PCB, ensuring consistent performance under varying conditions.

Operating Mode: DUAL GATE, DEPLETION MODE

The dual gate design allows for greater control of the channel, enabling more versatile application scenarios in RF amplification and switching.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

With capabilities in the ultra-high frequency range, this component is perfect for advanced telecommunications and RF applications, ensuring optimal signal integrity.

No. of Terminals: 4

Having four terminals enhances connectivity and flexibility in circuit design, enabling more complex configurations and minimization of parasitic effects.

Package Style (Meter): DISK BUTTON

The disk button package style promotes efficient integration within electronic devices while ensuring effective electromagnetic shielding.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, making this FET suitable for a wide range of low-voltage applications.

Transistor Element Material: SILICON

Silicon is a highly effective semiconductor material that offers reliable performance, making it a standard choice for various RF applications.

Terminal Position: RADIAL

The radial terminal position aids in versatile mounting options and simplifies the design process in compact layouts.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF980 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Minimum DS Breakdown Voltage:

18 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

O-CRDB-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

ROUND

Package Style (Meter):

DISK BUTTON

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

RADIAL

Transistor Element Material:

SILICON

Trade Compliance

BF980 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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