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BF244BZL1

Onsemi

BF244BZL1 by Onsemi

BF244BZL1 by Onsemi is an N-CHANNEL RF FET with 30V DS Breakdown Voltage. Ideal for AMPLIFIER applications in ULTRA HIGH FREQUENCY BAND, it features a SINGLE configuration and operates in DEPLETION MODE. Package: PLASTIC/EPOXY, Shape: ROUND, Terminals: 3.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,995 parts In-Stock

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1,995

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Digiode

USA . 993 parts In-Stock

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993

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Native Components

USA . 138 parts In-Stock

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$0.222

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$0.213

138

$0.222

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$0.213

Northwest PG Solutions

USA . 1,439 parts In-Stock

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$0.244

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$0.215

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$0.215

Kulean Microsystems

USA . 7,922 parts In-Stock

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7,922

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TANS Electronics

Latvia . 4,904 parts In-Stock

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SupplyDigital Components

Austria . 2,895 parts In-Stock

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Corphita

USA . 1,545 parts In-Stock

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Problanco Electronics

Mexico . 1,525 parts In-Stock

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UHIMA Technologies

Türkiye . 606 parts In-Stock

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Corohmni

South Africa . 362 parts In-Stock

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Overview

Upgrade your amplifier with the BF244BZL1 from Onsemi - a top-quality RF Small Signal Field Effect Transistor that delivers exceptional performance and reliability. With its N-CHANNEL configuration and ULTRA HIGH FREQUENCY BAND, this transistor is perfect for boosting signal strength in a variety of applications. Trust in Onsemi's reputation for excellence and experience the value and benefits this product brings to your projects. Elevate your electronics with the BF244BZL1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL type allows for efficient current flow and performance in amplifying applications.

Configuration: SINGLE

SINGLE configuration simplifies the design and integration process, making it easier to use in various circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in audio or signal amplification.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this transistor can handle higher voltages without failure, making it reliable for various applications.

Package Shape: ROUND

ROUND package shape provides easy mounting and installation in circular configurations, offering flexibility in use.

Terminal Form: THROUGH-HOLE

THROUGH-HOLE terminals make it easier to solder and connect the transistor securely to a circuit board.

Operating Mode: DEPLETION MODE

DEPLETION MODE operation allows for easier biasing in amplifier circuits, improving overall performance.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra high frequency applications, offering excellent speed and performance in high-frequency circuits.

No. of Terminals: 3

3 terminals provide easy connection and flexibility in circuit design, allowing for different configurations.

Package Style (Meter): CYLINDRICAL

CYLINDRICAL style offers space-saving design and easy integration into cylindrical enclosures or layouts.

Field Effect Transistor Technology: JUNCTION

JUNCTION technology provides efficient performance and reliability in amplification circuits, enhancing overall functionality.

Transistor Element Material: SILICON

SILICON material offers high conductivity and efficiency, ensuring reliable performance in various applications.

Terminal Finish: TIN LEAD

TIN LEAD finish provides good solderability and conductivity for secure connections in circuits.

Maximum Drain Current (ID): 0.1 A

With a maximum drain current of 0.1A, this transistor can handle current loads efficiently, making it suitable for many applications.

Terminal Position: BOTTOM

BOTTOM terminal position allows for easy mounting and connection in circuit layouts, enhancing usability and installation convenience.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF244BZL1 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.1 A

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF244BZL1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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