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BF511,215

NXP Semiconductors

BF511,215 by NXP Semiconductors

BF511,215 by NXP Semiconductors is an N-CHANNEL RF FET with a DEPLETION MODE. It operates in the VERY HIGH FREQUENCY BAND and has a max power dissipation of 0.25 W. Ideal for AMPLIFIER applications due to its small outline package style and GULL WING terminal form.

Median Price

$0.315

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 48 parts In-Stock

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$0.315

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48

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Vyrian

USA . 7,170 parts In-Stock

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Digiode

USA . 4,937 parts In-Stock

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4,937

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VNN

France . 1,000 parts In-Stock

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Anansix

USA . 718 parts In-Stock

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718

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,318 parts In-Stock

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$0.315

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$0.309

6,318

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Argo Parts USA

USA . 1,985 parts In-Stock

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$0.315

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$0.306

1,985

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$0.306

Corohmni

South Africa . 1,278 parts In-Stock

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$0.929

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$0.929

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Aztec Data Supply Inc.

USA . 303 parts In-Stock

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$1.480

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303

$1.480

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Advanced Electronics

New Zealand . 72 parts In-Stock

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$1.905

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$1.734

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$1.562

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72

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AZTECH Wire

Italy . 753 parts In-Stock

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$7.013

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Ampacity Inc.

Singapore . 1,286 parts In-Stock

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$29.050

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One Stop Electronics

USA . 1,472 parts In-Stock

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$61.050

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UNI Independent Distributors

Spain . 5,734 parts In-Stock

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Perfect Parts

USA . 5,118 parts In-Stock

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Corphita

USA . 2,064 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$0.309

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$0.299

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$0.293

500

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$0.309

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$0.293

Overview

Elevate your RF signal amplification with the BF511,215 by NXP Semiconductors. Crafted with precision and expertise, this N-CHANNEL FET offers unparalleled performance in the very high frequency band. Ideal for amplifier applications, this single configuration transistor boasts a small outline package and high reliability. Experience seamless integration and superior functionality with the BF511,215, setting new standards in RF signal processing. Upgrade your electronics with this industry-leading solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and protection, making this transistor suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer high efficiency and low ON-resistance, making them ideal for high-performance amplifier applications.

Configuration: SINGLE

The single configuration simplifies circuit design and allows for easy integration into existing systems.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor provides excellent signal amplification with low distortion.

Surface Mount: YES

The surface mount capability allows for easy and secure PCB mounting, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 20 V

The high breakdown voltage ensures reliable performance and protects against voltage spikes in the circuit.

Package Shape: RECTANGULAR

The rectangular package shape is compact and space-saving, making this transistor suitable for small electronic devices.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections, ensuring stable electrical contact.

Operating Mode: DEPLETION MODE

The depletion mode operation offers precise control over the transistor's conductance, enabling accurate signal amplification.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

With excellent high-frequency performance, this transistor is ideal for applications requiring fast signal processing.

No. of Terminals: 3

The three terminals provide flexibility and compatibility with various circuit configurations.

Maximum Power Dissipation (Abs): 0.25 W

The high power dissipation capability allows the transistor to handle larger power loads without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic designs.

Field Effect Transistor Technology: JUNCTION

The junction FET technology offers high reliability and performance, ensuring stable operation in demanding applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this transistor can withstand heat and operate reliably in various environments.

Transistor Element Material: SILICON

The silicon element material provides high conductivity and switching speeds, making this transistor efficient and responsive.

Terminal Finish: TIN

The tin terminal finish ensures corrosion resistance and reliable electrical connections, enhancing the transistor's durability.

Maximum Drain Current (ID): 0.03 A

The high maximum drain current rating allows the transistor to handle larger current loads, suitable for high-power applications.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit layout and simplifies connections in complex circuits.

Maximum Time At Peak Reflow Temperature (s): 30

This transistor can withstand peak reflow temperatures for up to 30 seconds, ensuring secure solder joints during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability enables the transistor to undergo reliable soldering processes without damage.

Maximum Feedback Capacitance (Crss): 0.4 pF

The low feedback capacitance minimizes signal distortion and interference, ensuring clean and accurate signal amplification.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF511,215 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Configuration:

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

.4 pF

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF511,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.75

SB

8541.21.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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