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BF1216

NXP Semiconductors

BF1216 by NXP Semiconductors

BF1216 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a 6V min DS breakdown voltage, operates in the ultra-high frequency band, and comes in a compact surface mount package. Ideal for enhancing signal amplification in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,148 parts In-Stock

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Anansix

USA . 2,284 parts In-Stock

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Vyrian

USA . 49 parts In-Stock

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49

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Native Components

USA . 585 parts In-Stock

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$0.110

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$0.106

585

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$0.106

Northwest PG Solutions

USA . 1,601 parts In-Stock

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$0.121

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$0.107

1,601

$0.121

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$0.107

One Stop Electronics

USA . 1,297 parts In-Stock

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$21.050

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1,297

$21.050

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Kepictronics

USA . 36,000 parts In-Stock

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36,000

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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UNI Independent Distributors

Spain . 4,742 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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2,700

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Corphita

USA . 2,410 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,800 parts In-Stock

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1,800

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Robosynatics

Brazil . 200 parts In-Stock

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$0.846

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$0.783

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$0.783

200

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$0.783

Lucentia Tech

USA . 200 parts In-Stock

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$0.846

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$0.783

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$0.783

200

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$0.846

$0.783

$0.783

Overview

Unlock unparalleled performance with the BF1216 from NXP Semiconductors, a leader in innovation. This high-quality RF Small Signal FET offers exceptional amplification capabilities in compact applications, ideal for ultra-high frequency operations. Its robust design ensures reliability and efficiency, empowering engineers to push the boundaries of technology with ease. Elevate your projects with NXP's trusted expertise and maximize your product’s potential today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection against environmental factors, making the FET suitable for use in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher electron mobility, resulting in better performance and efficiency in amplifying signals.

Configuration: COMPLEX

A complex configuration allows for enhanced functionality and integration in a variety of circuit designs, providing versatility.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this FET is optimized to deliver clean and high-quality signal amplification.

Surface Mount: YES

Surface mount technology simplifies assembly and improves reliability in modern electronic designs, making it a convenient choice for manufacturers.

Minimum DS Breakdown Voltage: 6 V

With a minimum breakdown voltage of 6 V, this FET can operate safely in low-voltage applications, reducing the risk of over-voltage damage.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient circuit layout and space-saving designs, ideal for compact electronic devices.

Terminal Form: GULL WING

Gull wing terminals provide a reliable surface mount connection, ensuring stable electrical performance and easy soldering.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for higher efficiency and lower power consumption, making it suitable for battery-powered applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Its capability to operate in the ultra-high frequency band makes it suitable for advanced communication systems and high-speed applications.

No. of Elements: 2

Having two elements allows for better signal handling and processing, enhancing overall performance in complex circuits.

No. of Terminals: 6

Six terminals provide multiple connection options, facilitating flexible circuit designs and ease of integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs, making it ideal for compact devices and applications where size matters.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology enables excellent performance characteristics such as fast switching and low on-resistance, enhancing efficiency.

Transistor Element Material: SILICON

Silicon material provides excellent thermal stability and performance, making it widely used and trusted in the industry.

Terminal Finish: TIN

Tin plating ensures good solderability and electrical conductivity, contributing to reliable connections in electronic assemblies.

Maximum Drain Current (ID): 0.03 A

With a maximum drain current of 0.03 A, this FET is suited for low-power applications, ensuring safe operation without overheating.

Terminal Position: DUAL

Dual terminal positions allow for flexible board designs and efficient layout options, maximizing space utilization and performance.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF1216 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Configuration:

Minimum DS Breakdown Voltage:

6 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF1216 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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